Module
AssigneeMurata Manufacturing Co., Ltd.
InventorTetsuya ODA
Life of this patent
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Abstract
A module includes a substrate including a first surface, a first component mounted on the first surface, at least a part of a surface of which on a side distant from the substrate is covered with a first conductive film, a sealing resin arranged to cover the first surface and the first component, and a shield film that covers at least a part of a surface of the sealing resin on the side distant from the substrate. The shield film includes a first shield portion superimposed on at least a part of the first conductive film and a second shield portion. The first shield portion is isolated from the second shield portion by a groove that divides the shield film and is provided to such a depth as entering the sealing resin. The first shield portion is electrically independent.
Claims11
A module comprising:
- a substrate including a first surface;
- a first component mounted on the first surface, wherein at least a part of a surface of the first component on a side distant from the substrate in a direction perpendicular to the first surface is covered with a first conductive film;
- a sealing resin arranged to cover the first surface and the first component;
- and
- a shield film covering at least a part of a surface of the sealing resin on the side distant from the substrate in the direction perpendicular to the first surface, wherein
- the shield film includes a first shield portion superimposed on at least a part of the first conductive film when viewed in the direction perpendicular to the first surface and a second shield portion different from the first shield portion, the first shield portion is isolated from the second shield portion by a groove dividing the shield film and provided to such a depth as entering the sealing resin, and the first shield portion is electrically independent.
Dependencies are inferred from the claim text.