Back to results
US 2023/0144191 A1Published application
Offset alignment and repair in micro device transfer
AssigneeVueReal Inc.
InventorGholamreza CHAJI
Life of this patent
Estimating the term…
Abstract
This invention relates to the process of correcting misalignment and filling voids after a microdevice transfer process. The process involves transfer heads, measurement of offset and misalignment in horizontal, vertical, and rotational errors. An execution of the new offset vector for the next transfer corrects the alignment.
Claims17
A method to operate a shared alignment system between multiple transfer heads, the method comprising:
- aligning each transfer head with an associated area in a system substrate using a shared alignment head;
- transferring a set of microdevices from at least one transfer head into the system substrate;
- moving each transfer head or the system substrate to enable an offset between the transfer head and the system substrate;
- and
- having a new set of microdevices from the at least one transfer head into a new area in the system substrate.
2 more elements
17-34. (canceled)
Dependencies are inferred from the claim text.