Heat sinking by thru-mold vias in shielded modules

An apparatus comprising:

• a molded module comprising a module board, at least one flip-chip die, and a mold compound with at least one via hole, wherein:
• the at least one flip-chip die is attached to a top surface of the module board;
• the mold compound resides over the top surface of the module board to fully encapsulate sides of the at least one flip-chip die and partially encapsulate a top surface of the at least one flip-chip die, wherein a top surface of the mold compound is vertically beyond the top surface of the at least one flip-chip die;
• the at least one via hole is vertically above the at least one flip-chip die and extends vertically from the top surface of the mold compound to the top surface of the at least one flip-chip die, such that a portion of the top surface of the at least one flip-chip die is not covered by the mold compound;
• and
• a top surface of the molded module is the top surface of the mold compound, a bottom surface of the molded module is a bottom surface of the module board, and a side surface of the molded module is a combination of a side surface of the mold compound and a side surface of the module board;
• and
• a shielding structure that completely covers surfaces within the at least one via hole, completely covers the top surface of the molded module, at least partially covers the side surface of the molded module, and does not cover the bottom surface of the molded module, wherein:
• the shielding structure is conductive and in contact with the top surface of the at least one flip-chip die;
• and
• portions of the shielding structure within the at least one via hole form at least one thru-mold via.