Method of manufacturing a three-dimensional electronic module having high component density, and device

A method of manufacturing of a three-dimensional electronics package of compactly accommodated components including:

• making of a workpiece of a metal-based printed-circuit board;
• bending of the metal-based printed-circuit board;
• and
• installation of electronic components on a surface of the metal-based printed-circuit wherein:
• a workpiece of the metal printed-circuit board comprises a fold-up unit, the flat surface areas of which form an n-angle, where n≥2, and suitable for forming edges of a spatial structure;
• surface-mount, through-hole components and electronic units are installed on the fold-up unit, therein the surface-mount, through-hole components and electronic components are grouped on a surface of at least two sections of the metal-based printed-circuit board so that their spatial areas will be kept unchanged during consecutive bending of the metal-based printed-circuit board;
• and
• the fold-up unit is bent so that the parts of the workpiece are consecutively turned around a bend line until electronic components of one section are brought into a free space between electronic components of another or of several other sections of the metal-based printed-circuit board.