Semiconductor laser inspection apparatus
AssigneeMitsubishi Electric Corporation
InventorsYohei MIKAMI, Tetsuhiro FUKAO
Life of this patent
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Abstract
A semiconductor laser device (2) is placed on a first heating-cooling device (1). A probe holder (4) is attached on a second heating-cooling device (3). A measurement probe (8) is fixed to a distal end of the probe holder (4). A fine movement table (9) moves the second heating-cooling device (3) and the probe holder (4) so that a distal end of the measurement probe (8) contacts the semiconductor laser device (2). An inspection apparatus (10) inputs an inspection signal to the semiconductor laser device (2) through the measurement probe (8).
Claims7
A semiconductor laser inspection apparatus comprising:
- a metal plate on which a semiconductor laser device is placed;
- a heating-cooling device;
- a probe holder attached on the heating-cooling device;
- a measurement probe fixed to a distal end of the probe holder;
- a fine movement table moving the heating-cooling device and the probe holder so that a distal end of the measurement probe contacts the semiconductor laser device;
- an inspection apparatus inputting an inspection signal to the semiconductor laser device through the measurement probe;
- and
- a spring having one end connected to an upper surface of the metal plate and the other end connected to a lower surface of the probe holder, wherein the spring thermally couples the metal plate and the probe holder without the measurement probe interposed therebetween.
A semiconductor laser inspection apparatus comprising:
- a heating-cooling device on which a semiconductor laser device is placed;
- a probe holder;
- a measurement probe fixed to a distal end of the probe holder;
- a fine movement table moving the probe holder so that a distal end of the measurement probe contacts the semiconductor laser device;
- an inspection apparatus inputting an inspection signal to the semiconductor laser device through the measurement probe;
- and
- a spring having one end connected to an upper surface of the heating-cooling device and the other end connected to a lower surface of the probe holder, wherein the spring thermally couples the heating-cooling device and the probe holder without the measurement probe interposed therebetween.
Dependencies are inferred from the claim text.