# US 2023/0143672 A1 · Molded microfluidic substrate having microfluidic channel > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2023/0143672 A1 - Document ID: US20230143672A1 - Status: Published application - Kind: A1 - Application number: 17/912,873 - Filed: 2020-04-10 - Published: 2023-05-11 - Earliest claimed: 2020-04-10 - Assignees: Hewlett-Packard Development Company, L.P. - Applicants: Hewlett-Packard Development Company, L.P. - Inventors: Chien-Hua Chen; Michael W. Cumbie; Michael G. Groh - Web page: https://patentgrep.com/patent/US20230143672A1 ## CPC - B01L 3/502707: {characterised by the manufacture of the container or its components} - B81C 1/00071: {Channels} - B01L 3/502715: {characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces} - B81B 2201/058: Microfluidics not provided for in B81B2201/051 - B81B2201/054 - B81B 2203/0338: Channels - B81B 2203/0392: profiles not provided for in B81B2203/0376 - B81B2203/0384 - B81C 2201/0107: Sacrificial metal - B01L: CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) ## Abstract A molded microfluidic substrate includes a molding compound layer. The molded microfluidic substrate includes a microfluidic channel. The microfluidic channel of the molded microfluidic substrate is formed within the molding compound layer of the molded microfluidic substrate. The microfluidic channel of the molded microfluidic substrate corresponds to a sacrificial metal bond wire. ## Claims ### Claim 1 A molded microfluidic substrate comprising: a molding compound layer; and a microfluidic channel formed within the molding compound layer and corresponding to a sacrificial metal bond wire. ### Claim 2 (depends on 1) The molded microfluidic substrate of claim 1, wherein the molding compound layer comprises an epoxy molding compound (EMC) layer. ### Claim 3 (depends on 1) The molded microfluidic substrate of claim 1, wherein the microfluidic channel has a round sidewall corresponding to a round profile of the sacrificial metal bond wire. ### Claim 4 (depends on 1) The molded microfluidic substrate of claim 1, wherein the microfluidic channel has a metal-plated sidewall, a non-sacrificial metal coating of the sacrificial metal bond wire forming the metal-plated sidewall. ### Claim 5 (depends on 1) The molded microfluidic substrate of claim 1, wherein the microfluidic channel has a portion at an exterior surface of the molding compound layer corresponding to an etched-way sacrificial metal portion of a molded-interconnect substrate (MIS) sacrificial metal bond layer. ### Claim 6 (depends on 1) The molded microfluidic substrate of claim 1, further comprising: another microfluidic channel formed within the molding compound layer and corresponding to a sacrificial metal ribbon. ### Claim 7 (depends on 1) The molded microfluidic substrate of claim 1, further comprising: a metal component formed by a non-sacrificial metal bond wire or ribbon within the molding compound layer. ### Claim 8 (depends on 7) The molded microfluidic substrate of claim 7, wherein the non-sacrificial metal bond wire or ribbon is a same metal as or a different metal than the sacrificial metal bond wire. ### Claim 9 A method comprising: providing a metal bond layer; attaching a sacrificial metal bond wire to the metal bond layer; bending the sacrificial metal bond wire in correspondence with a microfluidic channel to be formed; applying a molding compound, encasing the sacrificial metal bond wire within a molding compound layer; removing a portion of the molding compound layer, exposing the sacrificial metal bond wire within the molding compound layer; and etching away the sacrificial metal bond wire, yielding a molded microfluidic substrate having the microfluidic channel formed within the molding compound layer and corresponding to the etched-away sacrificial metal bond wire. ### Claim 10 (depends on 9) The method of claim 9, wherein providing the metal bond layer comprises: providing a non-molded-interconnect substrate (non-MIS) sacrificial metal carrier to which the sacrificial metal bond wire is subsequently attached and that is subsequently etched away with the sacrificial metal bond wire, a semiconductor die having a plurality of bond pads acting as the metal bond layer, or a semiconductor package having a plurality of contact pads acting as the metal bond layer. ### Claim 11 (depends on 9) The method of claim 9, wherein providing the metal bond layer comprises: forming a molded-interconnect substrate (MIS) sacrificial metal bond layer having a sacrificial metal portion to which the sacrificial metal bond wire is subsequently attached and that is subsequently etched away with the sacrificial metal bond wire, yielding a portion of the microfluidic channel corresponding to the etched-away sacrificial metal portion of the MIS sacrificial metal bond layer. ### Claim 12 (depends on 9) The method of claim 9, wherein the sacrificial metal bond wire has a non-sacrificial metal coating that remains after etching, forming a metal-plated sidewall of the microfluidic channel. ### Claim 13 (depends on 9) The method of claim 9, further comprising: attaching a sacrificial metal ribbon to the metal bond layer, the sacrificial metal ribbon subsequently etched away with the sacrificial metal bond wire, yielding another microfluidic channel of the molded microfluidic substrate formed within the molding compound layer and corresponding to the etched-away sacrificial metal ribbon. ### Claim 14 (depends on 9) The method of claim 9, further comprising: attaching a non-sacrificial metal bond wire or ribbon, wherein the non-sacrificial metal bond wire or ribbon is encased within the molding compound layer after application of the molding compound, remains after etching, and is exposed during removal of the portion of the molding compound layer, forming a metal component of the molded microfluidic substrate. ### Claim 15 An electronic device comprising: a molded microfluidic substrate having a microfluidic channel corresponding to a sacrificial metal bond wire or ribbon, and a metal component corresponding to a non-sacrificial metal bond wire or ribbon; and an integrated circuit in conductive contact with the metal component, in fluidic contact with the microfluidic channel, or in conductive contact with the metal component and in fluidic contact with the microfluidic channel.