Test socket for semiconductor integrated circuits

A test system for a semiconductor integrated circuit (IC), the test system comprising:

• a load board;
• and
• a test socket, comprising:
• a socket body including a top surface configured to face the semiconductor IC, and a bottom surface, mounted to the load board, the socket body defining a slot extending from the top surface to an aperture in the bottom surface;
• a rotational contact positioned in the slot in a pre-load state, the rotational contact configured to rotate between the pre-load state and a loaded state;
• and
• an elastomer retainer capturing the rotational contact in the socket body, the elastomer retainer including a round section about which the rotational contact is configured to rotate, and a quadrangle section that provides a contact force and a return force to the rotational contact, the elastomer retainer compressed between a socket frame and the rotational contact, and configured to further compress under rotational force from the rotational contact when rotating from the pre-load state to the loaded state upon engagement with the semiconductor IC.

A method of assembling a test system for a semiconductor integrated circuit (IC), the method comprising:

• positioning a plurality of rotational contacts in corresponding slots of a socket body for a test socket;
• positioning an elastomer retainer over the rotational contacts;
• and
• mounting a socket frame over the plurality of rotational contacts and the elastomer retainer.