Semiconductor apparatus and heating device in semiconductor apparatus
AssigneeBeijing Naura Microelectronics Equipment Co., Ltd.
InventorBing LI
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Abstract
The present disclosure discloses a heating device in a semiconductor apparatus and the semiconductor apparatus, including a heating body configured to carry a wafer, a heating member configured to generate heat being arranged in the heating body; and a cooling structure, which is arranged on the heating body below, and a cooling structure being arranged below the heating body. The cooling structure is configured to perform heat exchange with the heating body selectively at different positions away from the heating body. The heating device in the semiconductor apparatus and the semiconductor apparatus of the present disclosure are configured to expand an application temperature range of the heating device to satisfy different temperature requirements.
Claims20
A heating device in a semiconductor apparatus arranged in a process chamber of the semiconductor apparatus comprising:
- a heating body configured to carry a wafer, a heating member configured to generate heat being arranged in the heating body;
- and
- a cooling structure arranged below the heating body and configured to selectively perform heat exchange with the heating body at different positions away from the heating body.
A semiconductor apparatus comprising:
- a process chamber;
- and
- a heating device arranged in the process chamber and including:
- a heating body configured to carry a wafer, a heating member configured to generate heat being arranged in the heating body;
- and
- a cooling structure arranged below the heating body and configured to selectively perform heat exchange with the heating body at different positions away from the heating body.
Dependencies are inferred from the claim text.