Method and apparatus for removing particles or photoresist on substrates

A method for removing particles or photoresist on substrates, comprising:

• transferring one or more substrates into a SPM solution accommodated in a SPM bath;
• after the one or more substrates are processed in the SPM bath, taking the one or more substrates out from the SPM bath and rinsing the one or more substrates;
• and
• transferring the one or more substrates to one or more single chambers to perform single substrate cleaning and drying process, wherein the single substrate cleaning and drying process comprises at least one DIO3 oxidizing process.

A method for removing particles or photoresist on substrates, comprising:

• transferring one or more substrates to one or more single chambers to perform single substrate cleaning and drying process, wherein the single substrate cleaning and drying process comprises at least one DIO3 oxidizing process;
• after the one or more substrates are processed in the one or more single chambers, transferring the one or more substrates into a SPM solution accommodated in a SPM bath;
• after the one or more substrates are processed in the SPM bath, taking the one or more substrates out from the SPM bath and rinsing the one or more substrates;
• and
• transferring the one or more substrates to the one or more single chambers to perform single substrate cleaning and drying process.

An apparatus for removing particles or photoresist on substrates, comprising:

• a bench module, configured to implement one or more substrates bench cleaning process;
• a single module, having multiple single chambers configured to implement single substrate cleaning and drying process;
• and
• a process robot, configured to transfer the one or more substrates between the bench module and the single module;
• wherein the bench module has at least one DIO3 bath configured to accommodate DIO3 solution for processing the one or more substrates, at least one SPM bath configured to accommodate SPM solution for processing the one or more substrates, at least one DIW bath configured to accommodate DIW for rinsing the one or more substrates, and at least one second substrate transfer robot configured to transfer the one or more substrates among the DIO3 bath, the SPM bath and the DIW bath.