Carrier device for a thermal pad of an information handling system
AssigneeDell Products L.P.
InventorsJieh-I Taur, Bo-Wei Chu, Li-Chung Liu, Hui-Huan Chien
Life of this patent
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Abstract
In one embodiment, a carrier device for a thermal pad of an information handling system includes: a first adhesive surface coupled to the thermal pad, the thermal pad coupled to a first surface of a first component of the information handling system, the thermal pad configured to absorb a heat generated by the first component; a thermal transfer window configured to permit the heat generated by the first component to transfer from the thermal pad to a second surface of a second component of the information handling system; and a second adhesive surface removably coupled to the second surface of the second component.
Claims20
An information handling system, comprising:
- a first component;
- a second component;
- a thermal pad coupled to a first surface of the first component, the thermal pad configured to absorb a heat generated by the first component;
- and
- a carrier device including:
- a first adhesive surface coupled to the thermal pad;
- a thermal transfer window configured to permit the heat generated by the first component to transfer from the thermal pad to a second surface of the second component;
- and
- a second adhesive surface removably coupled to the second surface of the second component.
A method for managing thermal distribution for a first component of an information handling system, the method comprising:
- absorbing, by a thermal pad, a heat generated by the first component, the thermal pad coupled to a first surface of the first component;
- transferring, by the thermal pad, the heat generated by the first component to a second surface of a second component of the information handling system via a heat transfer window of a carrier device of the information handling system, the carrier device having a first adhesive surface coupled to the thermal pad and a second adhesive surface removably coupled to the second surface of the second component.
A carrier device for a thermal pad of an information handling system, comprising:
- a first adhesive surface coupled to the thermal pad, the thermal pad coupled to a first surface of a first component of the information handling system, the thermal pad configured to absorb a heat generated by the first component;
- a thermal transfer window configured to permit the heat generated by the first component to transfer from the thermal pad to a second surface of a second component of the information handling system;
- and
- a second adhesive surface removably coupled to the second surface of the second component.
Dependencies are inferred from the claim text.