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US 2023/0143320 A1Published application
Sputter trap having a thin high purity coating layer and method of making the same
AssigneeHoneywell International Inc.
InventorsJaeyeon Kim, Patrick Underwood, Susan D. Strothers, Shih-Yao Lin, Michael D. Payton, Scott R. Sayles
Life of this patent
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Abstract
An aluminum or copper alloy sputtering chamber includes a front surface, a back surface opposite the front surface, and a sputter trap formed on at least a portion of the front surface A coating of titanium particles is formed on the sputter trap.
Claims20
A sputtering chamber component comprising:
- a front surface formed of an aluminum or copper alloy;
- a back surface opposite the front surface;
- a sputter trap formed on at least a portion of the front surface, the sputter trap having a surface roughness greater than the back surface of the sputtering chamber component;
- and
- a coating of titanium particles formed on the sputter trap, the coating having a thickness from about 0.025 mm to about 2.54 mm (0.001 inches to about 0.1 inches) and is at least about 99.99% pure, wherein the titanium particles of the coating are substantially diffused and have plastic deformation.
2 more elements
A method of forming a sputter trap on an aluminum or copper alloy sputtering chamber component, the method comprising:
- cold spraying titanium particles on at least a portion of a textured surface of the sputtering chamber component such that the particles undergo plastic deformation and adhere to the textured surface to form a layer in which the individual particles are substantially indistinguishable from one another, the layer having a thickness from about 0.025 mm to about 2.54 mm (0.001 inches to about 0.1 inches) and is from about 99.99% to about 99.995% pure.
Dependencies are inferred from the claim text.