Heat-curable maleimide resin composition

Abstract

Provided is a heat-curable maleimide resin composition exhibiting no turbidity and separation when in the form of a varnish, and yielding a cured product that not only has excellent dielectric properties but also has a strong adhesive force to organic resins such as LCP and MPI and copper. The composition contains: (A) a styrene-based elastomer having a reactive functional group at both ends; (B) a maleimide compound represented by the following formula (1) wherein R1 represents a dimer acid skeleton-derived divalent hydrocarbon group; (C) an epoxy resin having at least two epoxy groups per molecule; and (D) an anionic polymerization initiating catalyst, wherein a ratio between the components (A) and (B) (mass ratio (A)/(B)) is 2 to 20.

Dependencies are inferred from the claim text.