Polyamide resin composition
AssigneeUbe Corporation
InventorsTetsuya YASUI, Akane SAKAMOTO, Yuki SUEDOMI, Hitoshi KODAMA, Kosuke OISHI, Takashi KUMAGAI, Mikako FUJITA
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AssigneeUbe Corporation
InventorsTetsuya YASUI, Akane SAKAMOTO, Yuki SUEDOMI, Hitoshi KODAMA, Kosuke OISHI, Takashi KUMAGAI, Mikako FUJITA
Estimating the term…
The present invention relates to a polyamide resin composition that is excellent in mechanical characteristics, bonding properties, calcium chloride resistance and fuel resistance and is suitably bonded to an acid-modified polyolefin, wherein the polyamide resin composition includes 40 to 93 mass % of an aliphatic polyamide resin (A) having an amino group concentration of 46 to 110 μmol/g, 2 to 10 mass % of an aromatic polyamide resin (B), 5 to 50 mass % of reinforcing fibers (C), and 0 to 53 mass % of a component (D) other than (A) to (C), and the total amount of (A) to (D) is 100 mass %, and wherein the amount of acid modification of the acid-modified polyolefin is 5 to 100 μmol/g.
1-8. (canceled)
A molded article comprising the polyamide resin composition and an acid-modified polyolefin, wherein at least part of the polyamide resin composition and at least part of the acid-modified polyolefin are bonded to each other, and
A method of using a polyamide resin composition for bonding to an acid-modified polyolefin,
A method of using a polyamide resin composition as an adhesive for an acid-modified polyolefin,
Dependencies are inferred from the claim text.