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US 2023/0142938 A1Published application
Semiconductor device and semiconductor package including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJINGU KIM, DOOHWAN LEE, SANGKYU LEE, JEONGHO LEE, TAESUNG JEONG
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Abstract
A semiconductor device includes a substrate having a recess region, a first electrode in the recess region and having a three-dimensional network structure, a first dielectric layer in the recess region and covering the first electrode, a second electrode in the recess region and covering the first dielectric layer, and a molding layer filling a remaining portion of the recess region and covering the second electrode.
Claims20
A semiconductor device comprising:
- a substrate having a recess region;
- a first electrode in the recess region and having a three-dimensional network structure;
- a first dielectric layer in the recess region and covering the first electrode;
- a second electrode in the recess region and covering the first dielectric layer;
- and
- a molding layer filling a remaining portion of the recess region and covering the second electrode.
3 more elements
A semiconductor package comprising:
- an interposer substrate;
- and
- a semiconductor chip mounted on a top surface of the interposer substrate,
- wherein the interposer substrate comprises:
- a substrate layer having a recess region;
- a capacitor in the recess region;
- and
- an interconnection layer on the substrate layer,
- wherein the capacitor comprises:
- a first electrode having a three-dimensional network structure, wherein the three-dimensional network structure of the first electrode has first embossed surfaces;
- a first dielectric layer covering the first embossed surfaces of the first electrode to have second embossed surfaces;
- and
- a second electrode covering the second embossed surfaces of the first dielectric layer.
10 more elements
A semiconductor package comprising:
- an interposer substrate comprising a capacitor therein;
- a first semiconductor chip mounted on a top surface of the interposer substrate;
- and
- a plurality of external terminals on a bottom surface of the interposer substrate,
- wherein the capacitor comprises:
- a first electrode having a three-dimensional network structure in which a plurality of particles are connected with each other;
- a first dielectric layer covering the first electrode;
- a second electrode covering the first dielectric layer;
- a first electrode pad connected to the first electrode;
- and
- a second electrode pad connected to the second electrode.
8 more elements
Dependencies are inferred from the claim text.