Integrated device package with an integrated heat sink
AssigneeAnalog Devices, Inc.
InventorsMichael John Anderson, Edward Olsen
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Abstract
An integrated device package is disclosed. The integrated device package can include an electronic component package which includes an electronic component. The integrated device package can include a protective material in which the electronic component is at least partially embedded, wherein the electronic component package comprises a first surface and a second surface. The integrated device package can include a heat sink plated on the first surface. The heat sink can include a base portion and a plurality of heat-dissipating projections extending outwardly therefrom.
Claims20
An integrated device package comprising:
- an electronic component package comprising:
- an electronic component;
- and
- a protective material in which the electronic component is at least partially embedded;
- wherein the electronic component package comprises a first surface and a second surface;
- and
- a heat sink plated onto the first surface.
A method of manufacturing an integrated device package, the method comprising:
- at least partially embedding an electronic component within a protective material of an electronic component package, the electronic component package comprising a first surface and a second surface;
- and
- electroplating a heat sink onto the first surface.
Dependencies are inferred from the claim text.