Semiconductor device and manufacturing method therefor
AssigneeFuji Electric Co., Ltd.
InventorsYuichiro HINATA, Naoyuki KANAI, Takashi SAITO
Life of this patent
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Abstract
A semiconductor device includes an insulated circuit board having a conductive pattern layer, a sintered member disposed on the conductive pattern layer, a semiconductor chip placed on the sintered member, and a coating material covering the semiconductor chip. The sintered member has, on a surface thereof opposite to the conductive pattern layer, a frame shaping the outer edge of a recess. The semiconductor chip is mounted in the recess such that its top face is located closer to the conductive pattern layer than a top end of the frame.
Claims13
A semiconductor device, comprising:
- an insulated circuit board including a conductive pattern layer;
- a sintered member disposed on the conductive pattern layer, the sinter member having a frame formed on a surface thereof opposite to the conductive pattern layer, to thereby form a recess on the surface, the frame shaping an outer edge of the recess;
- a semiconductor chip having a top face, a bottom face opposite to the top face, and a lateral face, the semiconductor chip being mounted in the recess with the bottom face opposing the recess, the top face being located closer to the conductive pattern layer than a top end of the frame;
- and
- a coating material covering the semiconductor chip mounted in the recess.
A semiconductor device manufacturing method, comprising:
- preparing an insulated circuit board having a conductive pattern layer and a semiconductor chip having a top face, a bottom face, and a lateral face;
- disposing a sintered member on the conductive pattern layer;
- shaping the sintered member by
- placing the semiconductor chip on the sintered member such that the bottom face opposes the sintered member, and
- pressurizing, via the top face of the semiconductor chip, a region of the sintered member in contact with the bottom face of the semiconductor chip toward the conductive pattern layer,
- so as to form a frame, to thereby form a recess in which the semiconductor chip is mounted, the frame shaping an outer edge of the recess and having a top end located at a higher level than the top face of the semiconductor chip;
- and
- placing a coating material in the recess to cover the semiconductor chip.
Dependencies are inferred from the claim text.