Plasma edge ring, plasma etching apparatus including the same, and plasma etching method using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsHyunjoo LEE, Sang Ki NAM, Young Hyun JO
Life of this patent
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Abstract
Disclosed are plasma edge rings, plasma etching apparatuses, and plasma etching methods. The plasma etching apparatus comprises a plasma electrode, a plasma edge ring on the plasma electrode, and a guide electrode outside an etching target on the plasma electrode. The plasma edge ring provides a placement hole that vertically penetrates a center of the plasma edge ring, and a recess on a portion of an inner lateral surface that defines the placement hole. The recess is outwardly recessed from the inner lateral surface.
Claims21
A plasma etching apparatus, comprising:
- a plasma electrode;
- a plasma edge ring on the plasma electrode;
- and
- a guide electrode outside an etching target on the plasma electrode,
- wherein the plasma edge ring includes an inner sidewall surface including
- a first surface portion that at least partially defines a placement hole that vertically penetrates a center of the plasma edge ring, and
- a second surface portion that at least partially defines a recess that is recessed away from the center of the plasma edge ring in relation to the first surface portion of the inner sidewall surface.
A plasma etching apparatus, comprising:
- a plasma electrode;
- a support member on a top surface of the plasma electrode;
- a plasma edge ring that surrounds the support member;
- a guide electrode;
- a plasma voltage supply that is configured to apply a first voltage to the plasma electrode;
- and
- a guide voltage supply that is configured to apply a second voltage to the guide electrode,
- wherein the guide electrode is outside the support member.
A plasma etching ring, comprising:
- a plate body having a central axis that extends vertically,
- wherein the plate body includes an inner sidewall surface including
- a first surface portion that at least partially defines a placement hole that vertically penetrates the central axis of the plate body;
- and
- a second surface portion that at least partially defines a recess that is recessed away from the center of the plasma edge ring in relation to the first surface portion of the inner sidewall surface and is recessed into an interior of the plate body,
- wherein the second surface portion includes a recess top surface that is beneath a top surface of the plate body, the recess top surface defining a portion of the recess.
21-25. (canceled)
Dependencies are inferred from the claim text.