Semiconductor package manufacturing method

A semiconductor package manufacturing method comprising:

• attaching solder balls to a substrate provided on a chuck, the chuck comprising a plurality of divided regions;
• providing information about a warpage shape of the substrate to the chuck;
• and
• individually controlling positions of each of the plurality of divided regions based on the information.

A semiconductor package manufacturing method which uses a semiconductor package manufacturing apparatus including:

• a chuck;
• a solder device configured to attach solder balls to a substrate provided on the chuck;
• and a scanning device configured to provide information about a shape of the substrate to the solder device, wherein the chuck includes an adsorbing portion including a plurality of divided regions, each of which is configured to adsorb the substrate, and a driver configured to drive each of the plurality of divided regions, the scanning device includes a first sensor, the chuck includes a second sensor, the semiconductor package manufacturing method comprising:
• providing the substrate on the chuck;
• obtaining information indicating a warpage shape of the substrate using the first sensor;
• identifying a movement distance for each of the plurality of divided regions according to the information;
• measuring a distance between each of the plurality of divided regions and the substrate using the second sensor;
• moving each of the plurality of divided regions to an initial position based on the movement distance using the driver;
• adsorbing the substrate to the chuck based on each of the plurality of divided regions reaching an adsorption distance at which vacuum adsorption is enabled;
• moving each of the plurality of divided regions back to the initial position;
• and
• detaching the substrate from the plurality of divided regions while positioned at the initial position.