Structural body and heating apparatus

Abstract

A structural body (2, 2A to 2E) according to the present disclosure includes a base (10, 10D, 10E), a first electrode layer (111), a second electrode layer (112), a first via conductor (131), a second via conductor (132), and a connection conductor (133). The base (10, 10D, 10E) is composed of a ceramic. The first electrode layer (111) and the second electrode layer (112) are located inside the base (10, 10D, 10E). The first via conductor (131) and the second via conductor (132) are located inside the base (10, 10D, 10E) and connect the first electrode layer (111) and the second electrode layer (112). The connection conductor is located inside the base (10, 10D, 10E), and connects the first via conductor and the second via conductor.

Dependencies are inferred from the claim text.