Semiconductor package

A semiconductor package comprising:

• a first redistribution structure comprising a plurality of first redistribution layers and a plurality of first redistribution vias;
• a semiconductor chip on the first redistribution structure, the semiconductor chip comprising a chip pad;
• a connection pad between the first redistribution structure and the semiconductor chip, the connection pad connected to the first redistribution structure;
• a connection bump connected to the connection pad and the chip pad;
• a molding layer extending around the first redistribution structure and the semiconductor chip;
• a through electrode extending through the molding layer;
• a wetting layer between the first redistribution structure and the molding layer;
• and
• a second redistribution structure on the molding layer, the second redistribution structure comprising second redistribution layers and second redistribution vias,
• wherein a width of each first redistribution via increases from an upper surface of the first redistribution via toward a lower surface of the first redistribution via, and wherein a width of each second redistribution via decreases from an upper surface of the second redistribution via toward a lower surface of the second redistribution via.

A semiconductor package comprising:

• a first redistribution structure comprising a plurality of first redistribution layers and a plurality of first redistribution vias;
• a semiconductor chip on the first redistribution structure, the semiconductor chip comprising a chip pad;
• a connection pad between the first redistribution structure and the semiconductor chip, the connection pad connected to the first redistribution structure;
• a metal layer on an upper surface and side surfaces of the connection pad;
• a connection bump connected to the metal layer and the semiconductor chip;
• a molding layer extending around the first redistribution structure and the semiconductor chip;
• a second redistribution structure on the molding layer, the second redistribution structure comprising second redistribution layers and second redistribution vias,
• a wetting layer between the first redistribution structure and the molding layer;
• and
• a through electrode extending through the molding layer, wherein the through electrode is connected to the first redistribution via and to the second redistribution via, and wherein the through electrode has a uniform width,
• wherein a width of each first redistribution via increases from an upper surface of the first redistribution via toward a lower surface of the first redistribution via, and wherein a width of each second redistribution via decreases from an upper surface of the second redistribution via toward a lower surface of the second redistribution via.