Cooler and semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsNaoki YOSHIMATSU, Ryoji MURAI
Life of this patent
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Abstract
Provided is a cooler that is less likely to cause an uneven degree of cooling during cooling of multiple cooling targets. The cooler is thus provided inside with a flow path of a refrigerant, the flow path including: an outer-peripheral-side header region that is provided on an outer peripheral side of an annular shape and extends in a circumferential direction of the annular shape; an inner-peripheral-side header region that is provided on an inner peripheral side of the annular shape across a separation region from the outer-peripheral-side header region and extends in the circumferential direction; and a fin region serving as the separation region in which a fin is disposed.
Claims17
A cooler having an annular shape in plan view from a first direction, the cooler comprising:
- a flow path of a refrigerant, the flow path being provided inside the cooler,
- the flow path including:
- an outer-peripheral-side header region that is provided on an outer peripheral side of the annular shape and extends in a circumferential direction of the annular shape;
- an inner-peripheral-side header region that is provided on an inner peripheral side of the annular shape across a separation region from the outer-peripheral-side header region and extends in the circumferential direction;
- and
- a fin region serving as the separation region in which a fin is disposed.
Dependencies are inferred from the claim text.