Method and interconnect interface for built-in self-test
AssigneeShanghai Zhaoxin Semiconductor Co., Ltd.
InventorsChunhui ZHENG, Jiao LI
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Abstract
A method for built-in self-test, including the following operations: at a transmitting part, selecting a gold pattern, generating a test pattern using the gold pattern and a header corresponding to the gold pattern, and transmitting the test pattern to a receiving part via a tested path; and at a receiving part, parsing the header and a received pattern from the test pattern received, obtaining the gold pattern corresponding to the header based on the header parsed, and obtaining a test result of the tested path by comparing the gold pattern to the received pattern.
Claims10
A method for built-in self-test, including the following operations:
- at a transmitting part, selecting a gold pattern, generating a test pattern using the gold pattern and a header corresponding to the gold pattern, and transmitting the test pattern to a receiving part via a tested path;
- and
- at the receiving part, parsing the header and a received pattern from the test pattern received, obtaining the gold pattern corresponding to the header based on the header parsed, and obtaining a test result of the tested path by comparing the gold pattern to the received pattern.
An interconnect interface for built-in self-test, comprising:
- a first connection interface, comprising a first pattern generation module and a first pattern comparison module, which are respectively in a first transmitting part and a first receiving part of the first connection interface;
- a second connection interface, coupled to the first connection interface, comprising a second pattern generation module and a second pattern comparison module, which are respectively in a second transmitting part and a second receiving part;
- wherein at the first transmitting part, the first pattern generation module is configured to select a first gold pattern, and to generate a first test pattern using the first gold pattern and a first header corresponding to the first gold pattern, wherein the first test pattern is transmitted to the second receiving part of the second connection interface via a first tested path;
- and
- at the second receiving part, the first header and a first received pattern are parsed from the first test pattern received, and the second comparison module is configured to obtain the first gold pattern corresponding to the first header based on the first header parsed, and to obtain a first test result of the first tested path by comparing the first gold pattern to the first received pattern.
The interconnect interface as claimed in clime 4, wherein the first pattern comparison module is further configured to obtain the first test result of the first tested path by comparing the first received pattern to the first gold pattern and calculating a bit error rate.
Dependencies are inferred from the claim text.