Module and method of manufacturing the same
AssigneeMurata Manufacturing Co., Ltd.
InventorTetsuya ODA
Life of this patent
Estimating the term…
Abstract
A module includes a substrate including a first surface, a first component mounted on the first surface, at least a part of which is covered with a first conductive film, a sealing resin arranged to cover the first surface and the first component, and a shield film that covers a part of a surface of the sealing resin on a side distant from the substrate. The surface of the sealing resin on the side distant from the substrate includes a shielded region covered with the shield film when viewed in a direction perpendicular to the first surface and a non-shielded region not covered with the shield film. The non-shielded region is superimposed on at least a part of the first conductive film.
Claims11
A module comprising:
- a substrate including a first surface;
- a first component mounted on the first surface, at least a part of a surface of the first component on a side distant from the substrate in a direction perpendicular to the first surface is covered with a first conductive film;
- a sealing resin arranged to cover the first surface and the first component;
- and
- a shield film that covers a part of a surface of the sealing resin on the side distant from the substrate in the direction perpendicular to the first surface, wherein
- the surface of the sealing resin on the side distant from the substrate includes a shielded region covered with the shield film when viewed in the direction perpendicular to the first surface and a non-shielded region not covered with the shield film, and
- the non-shielded region is superimposed on at least a part of the first conductive film when viewed in the direction perpendicular to the first surface.
A method of manufacturing a module comprising:
- preparing a substrate assembly including a first surface;
- mounting a first component on the first surface;
- forming a sealing resin to cover the first surface and the first component;
- bonding a sheet to cover a surface of the sealing resin on a side distant from the first surface;
- providing a groove in the sealing resin from above the sheet such that the groove surrounds the first component when viewed in a direction perpendicular to the first surface;
- removing the sheet in a region other than a region surrounded by the groove;
- dividing the substrate assembly and the sealing resin into a size of an individual module;
- forming a shield film to cover an upper surface and a side surface of the sealing resin of the size of the individual module;
- and
- removing the sheet from the region surrounded by the groove after the forming the shield film.
Dependencies are inferred from the claim text.