Semiconductor package, and method of manufacturing the same

A semiconductor package comprising:

• a first semiconductor chip comprising a first substrate, a plurality of first pads above the first substrate, and a first insulating layer above the first substrate and surrounding the plurality of first pads,
• a second semiconductor chip on the first semiconductor chip, the second semiconductor chip comprising a second substrate, a plurality of second pads below the second substrate, and a second insulating layer below the second substrate and surrounding the plurality of second pads,
• wherein the first semiconductor chip and the second semiconductor chip are electrically connected to each other by a pair of a first bonding pad structure and a second bonding pad structure that each comprise one of the plurality of first pads and one of the plurality of second pads,
• wherein the semiconductor package further comprises a first air gap that surrounds the first bonding pad structure, and a second air gap that surrounds the second bonding pad structure, and
• wherein the semiconductor package further comprises:
• first bonding surfaces that are defined by at least a portion of the first insulating layer and at least a portion of the second insulating layer that are in contact with each other, between the first bonding pad structure and the first air gap and between the second bonding pad structure and the second air gap;
• and
• a second bonding surface that is defined by at least a portion of the first insulating layer and at least a portion of the second insulating layer that are in contact with each other, between the first air gap and the second air gap.

A semiconductor package comprising:

• a first semiconductor chip comprising a first substrate, a first pad above the first substrate, and a first insulating layer comprising a first recess that surrounds the first pad;
• and
• a second semiconductor chip on the first semiconductor chip, the second semiconductor chip comprising a second substrate, a second pad below the second substrate and contacting the first pad, and a second insulating layer comprising a second recess that surrounds the second pad,
• wherein the second insulating layer contacts the first insulating layer, and
• wherein a side surface of each of the first pad and the second pad is entirely covered with the first insulating layer and the second insulating layer, respectively.