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US 2023/0141402 A1Published application
Wiring circuit board
AssigneeNitto Denko Corporation
InventorsShusaku Shibata, Teppei Niino, Yosuke Nakanishi
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Abstract
Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, and a second protective layer disposed between the first insulating layer and protecting the conductive pattern. The second protective layer consists of a metal oxide.
Claims5
A wiring circuit board comprising:
- a first insulating layer;
- a conductive pattern disposed on the first insulating layer;
- and
- a protective layer disposed between the first insulating layer and the conductive pattern and protecting the conductive pattern,
- wherein the protective layer consists of a metal oxide.
2 more elements
Dependencies are inferred from the claim text.