Redistribution substrate and semiconductor package including the same

A redistribution substrate, comprising:

• a first power/ground interconnection layer having a first insulating pattern, a first dummy pattern and a first power/ground pattern, the first dummy pattern and the first power/ground pattern being in the first insulating pattern;
• and
• a first signal interconnection layer stacked on the first power/ground interconnection layer, the first signal interconnection layer having a second insulating pattern, a second dummy pattern and a first signal pattern, the second dummy pattern and the first signal pattern being in the second insulating pattern,
• wherein the first dummy pattern is vertically overlapped with the first signal pattern, the second dummy pattern is vertically overlapped with the first power/ground pattern, the first dummy pattern comprises dot patterns, and the second dummy pattern comprises a plate pattern.

A semiconductor package, comprising:

• a substrate;
• a first semiconductor chip on the substrate;
• and
• a mold layer on the substrate to cover the first semiconductor chip,
• wherein the substrate comprises:
• an insulating layer;
• a signal pattern in the insulating layer;
• a power/ground pattern in the insulating layer;
• and
• a first dummy pattern and a second dummy pattern in the insulating layer, and
• wherein the first dummy pattern vertically overlaps the signal pattern, the second dummy pattern vertically overlaps the power/ground pattern, the first dummy pattern comprises dot patterns, and the second dummy pattern comprises a plate pattern.