Flux resin composition, electronic component, method for manufacturing the electronic component, mounting structure, and method for manufacturing the mounting structure
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsShohei SANADA, Shigeru YAMATSU
Life of this patent
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Abstract
A flux resin composition includes an epoxy resin, an imidazole compound, a thixo agent, and an activator. The epoxy resin includes at least one resin selected from the group consisting of naphthalene epoxy resins, biphenyl aralkyl epoxy resins, trisphenol methane epoxy resins, biphenyl epoxy resins, and dicyclopentadiene epoxy resins. The content of the at least one resin is equal to or greater than 20% by weight with respect to a total weight of the epoxy resin.
Claims19
A flux resin composition comprising an epoxy resin (A), an imidazole compound (B), a thixo agent (C), and an activator (D),
- the epoxy resin (A) including at least one resin selected from the group consisting of naphthalene epoxy resins, biphenyl aralkyl epoxy resins, trisphenol methane epoxy resins, biphenyl epoxy resins, and dicyclopentadiene epoxy resins, content of the at least one resin being equal to or greater than 20% by weight with respect to a total weight of the epoxy resin (A),
- a time it takes for a value calculated by
- (viscosity of the flux resin composition after storage/viscosity of the flux resin composition at beginning of the storage)×100(%)
- to reach 120% since the flux resin composition has started to be stored at 25° C. being equal to or longer than 24 hours,
- the flux resin composition allowing a solder ball to have a wet spreadability equal to or greater than 50% before and after a reflow process,
- a cured product of the flux resin composition having a glass transition temperature equal to or higher than 85° C.
Dependencies are inferred from the claim text.