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US 2023/0141036 A1Published application
Thermal control for electronic devices
AssigneeSamsung Electronics Co., Ltd.
InventorsPyeongwoo Lee, Young deok Kim, Sumanth Jannyavula Venkata
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Abstract
A method for temperature control. In some embodiments, the method includes sensing a first temperature of an electronic device, determining that the first temperature exceeds a first threshold, and increasing a power supplied to a thermoelectric cooler thermally connected to the electronic device. The increasing of the power may include increasing the power in response to determining that the first temperature exceeds the first threshold.
Claims19
A method for temperature control, the method comprising:
- sensing a first temperature of an electronic device;
- determining that the first temperature exceeds a first threshold;
- and
- in response to determining that the first temperature exceeds the first threshold, increasing a power supplied to a thermoelectric cooler thermally connected to the electronic device;
- sensing second temperature of the electronic device;
- determining that the second temperature exceeds the first threshold;
- in response to determining that the second temperature exceeds the first threshold, determining that the power supplied to the thermoelectric cooler satisfies a criterion;
- and
- in response to determining that the power suppled to the thermoelectric cooler satisfies the criterion, limiting an activity rate of the electronic device.
6 more elements
A system, comprising:
- a controller comprising:
- a processing circuit;
- and
- a memory;
- a first solid state drive in communication with the controller;
- a first thermoelectric cooler thermally connected to the first solid state drive;
- a second solid state drive in communication with the controller;
- and
- a second thermoelectric cooler thermally connected to the second solid state drive,
- the memory storing instructions that, when executed by the processing circuit, cause the processing circuit to:
- cause a temperature sensor to sense a first temperature of the first solid state drive;
- determine that the first temperature exceeds a first threshold;
- and
- in response to determining that the first temperature exceeds the first threshold, cause a first drive circuit to increase a power supplied to the first thermoelectric cooler and further cause a second drive circuit to increase the power supplied to the second thermoelectric cooler.
11 more elements
A system, comprising:
- a controller comprising:
- means for processing;
- and a memory;
- a first solid state drive in communication with the controller;
- a first thermoelectric cooler thermally connected to the first solid state drive;
- a second solid state drive in communication with the controller;
- and
- a second thermoelectric cooler thermally connected to the second solid state drive,
- the memory storing instructions that, when executed by the means for processing, cause the means for processing to:
- sense a first temperature of the first solid state drive;
- determine that the first temperature exceeds a first threshold;
- and
- in response to determining that the first temperature exceeds the first threshold, increase a power supplied to the first thermoelectric cooler and further increase the power supplied to the second thermoelectric cooler.
10 more elements
Dependencies are inferred from the claim text.