Pressure puck diagnostic wafer
AssigneeApplied Materials, Inc.
InventorsKostiantyn Achkasov, Peter Reimer, Shawn Thanhson Le, Sohrab Zokaei
Life of this patent
Estimating the term…
Abstract
Exemplary diagnostic wafers for a semiconductor processing chamber may include a wafer body defining a plurality of recesses. The diagnostic wafers may include at least one data logging puck positionable within one of the plurality of recesses. The diagnostic wafers may include at least one battery puck positionable within one of the plurality of recesses. The diagnostic wafers may include at least one sensor puck positionable within one of the plurality of recesses.
Claims20
A diagnostic wafer for a semiconductor processing chamber, comprising:
- a wafer body defining a plurality of recesses;
- at least one data logging puck positionable within one of the plurality of recesses;
- at least one battery puck positionable within one of the plurality of recesses;
- and
- at least one sensor puck positionable within one of the plurality of recesses.
A diagnostic wafer for a semiconductor processing chamber, comprising:
- a wafer body defining a plurality of recesses, each of the plurality of recesses comprising a plurality of electrical contacts, wherein the wafer body comprises a connection circuit that electrically couples the plurality of electrical contacts of each of the plurality of recesses with the plurality of electrical contacts of at least one other of the plurality of recesses;
- a plurality of battery pucks positionable within one of the plurality of recesses;
- and
- a plurality of sensor pucks positionable within one of the plurality of recesses.
A method of monitoring conditions within a semiconductor processing chamber, the method comprising:
- positioning a diagnostic wafer on a substrate support of a semiconductor processing chamber, the diagnostic wafer comprising:
- a wafer body defining a plurality of recesses;
- at least one data logging puck positionable within one of the plurality of recesses;
- at least one battery puck positionable within one of the plurality of recesses;
- and
- at least one sensor puck positionable within one of the plurality of recesses;
- performing one or more processing operations within the semiconductor processing chamber;
- and
- monitoring at least one operating condition within the semiconductor processing chamber using the at least one sensor puck.
Dependencies are inferred from the claim text.