Coating system with turbo

A method for thin-film deposition, comprising:

• providing a deposition chamber having a proximal end and a distal end, wherein the deposition chamber is shaped and sized to hold one or more specimens;
• arranging the one or more specimens in the deposition chamber;
• coupling a pumping system to the distal end of the deposition chamber, wherein the pumping system comprises at least:
• a first pump associated with a first pump down curve;
• and
• a second pump associated with a second pump down curve, wherein the first pump down curve is different from the second pump down curve;
• controlling activation of the first pump to start a pump down operation of the deposition chamber;
• determining a cut-in pressure for switching operation from the first pump to the second pump;
• monitoring an internal pressure of the deposition chamber;
• switching operation of the pumping system from the first pump to the second pump based at least in part on determining that the internal pressure of the deposition chamber is at or below the cut-in pressure;
• and
• controlling the second pump, wherein controlling the second pump comprises continuing, using the second pump, the pump down operation of the deposition chamber until the internal pressure is at or below a target pressure for thin-film deposition.

A non-transient computer-readable storage medium having instructions embodied thereon, the instructions being executable by one or more processors to perform a method for thin-film deposition, the method comprising:

• providing a deposition chamber having a proximal end and a distal end, wherein the deposition chamber is shaped and sized to hold one or more specimens;
• arranging the one or more specimens in the deposition chamber;
• coupling a pumping system to the distal end of the deposition chamber, wherein the pumping system comprises at least:
• a first pump associated with a first pump down curve;
• and
• a second pump associated with a second pump down curve, wherein the first pump down curve is different from the second pump down curve;
• controlling activation of the first pump to start a pump down operation of the deposition chamber;
• determining a cut-in pressure for switching operation from the first pump to the second pump;
• monitoring an internal pressure of the deposition chamber;
• switching operation of the pumping system from the first pump to the second pump based at least in part on determining that the internal pressure of the deposition chamber is at or below the cut-in pressure;
• and
• controlling the second pump, wherein controlling the second pump comprises continuing, using the second pump, the pump down operation of the deposition chamber until the internal pressure is at or below a target pressure for thin-film deposition.