Electronic component and manufacturing method therefor

An electronic component comprising:

• a substrate;
• and
• a plurality of conductor layers and a plurality of insulating resin layers which are alternately stacked on the substrate,
• wherein the plurality of insulating resin layers include a first insulating resin layer positioned in a lowermost layer and a plurality of second insulating resin layers positioned on the first insulating resin layer,
• wherein the plurality of conductor layers include a first conductor layer embedded in the first insulating resin layer and a plurality of second conductor layers embedded respectively in the plurality of second insulating resin layers,
• wherein the first conductor layer includes a capacitor constituted by a lower electrode and an upper electrode stacked on the lower electrode through a dielectric film made of an inorganic insulating material,
• wherein the plurality of second conductor layers include a coil pattern,
• wherein the first insulating resin layer is smaller in thickness than each of the second insulating resin layers, and
• wherein the second insulating resin layers are smaller in thermal expansion coefficient than the first insulating resin layer.