Back to results
US 2023/0125153 A1Published application
Bonding sheet
AssigneeNitto Denko Corporation
InventorsAkiko TANAKA, Yuichiro SHISHIDO, Ayumi NISHIMARU
Life of this patent
Estimating the term…
Abstract
A bonding sheet (X) of the present invention includes a matrix resin, a plurality of solder particles, and a plurality of flux particles, and has a sheet thickness T. In the bonding sheet (X), a particle size D50 of the solder particles is 12 μm or less, a particle size D50 of the flux particles is 30 μm or less, and a ratio of a particle size D90 of the solder particles and a particle size D90 of the flux particles to the sheet thickness T is 0.95 or less.
Claims9
A bonding sheet comprising:
- a matrix resin, a plurality of solder particles, and a plurality of flux particles, and having a sheet thickness T, wherein
- a particle size D50 of the solder particles is 12 μm or less,
- a particle size D50 of the flux particles is 30 μm or less, and
- a ratio of a particle size D90 of the solder particles and a particle size D90 of the flux particles to the sheet thickness T is 0.95 or less.
1 more element
Dependencies are inferred from the claim text.