Power Module with Press-Fit Contacts
AssigneeInfineon Technologies AG
InventorsIvan Nikitin, Peter Luniewski
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Abstract
A method of forming a semiconductor device includes providing a power electronics carrier including a structured metallization layer disposed on an electrically insulating substrate, mounting one or more semiconductor dies on a portion of the structured metallization layer, forming an encapsulant body of electrically insulating material that covers the power electronics carrier and encapsulates the one or more semiconductor dies, securing a press-fit connector to the power electronics carrier with a base portion of the press-fit connector being disposed within an opening in the encapsulant body and with an interfacing end of the press-fit connector being electrically accessible from outside the encapsulant body.
Claims19
A method of forming a semiconductor device, the method comprising:
- providing a power electronics carrier comprising a structured metallization layer disposed on an electrically insulating substrate;
- mounting one or more semiconductor dies on a portion of the structured metallization layer;
- forming an encapsulant body of electrically insulating material that covers the power electronics carrier and encapsulates the one or more semiconductor dies;
- securing a press-fit connector to the power electronics carrier with a base portion of the press-fit connector being disposed within an opening in the encapsulant body and with an interfacing end of the press-fit connector being electrically accessible from outside the encapsulant body.
A semiconductor device, comprising:
- a power electronics carrier comprising a structured metallization layer disposed on an electrically insulating substrate;
- one or more semiconductor dies on a portion of the structured metallization layer;
- an encapsulant body of electrically insulating material that covers the power electronics carrier and encapsulates the one or more semiconductor dies;
- and
- a press-fit connector secured to the power electronics carrier with a base portion of the press-fit connector being disposed within an opening in the encapsulant body and with an interfacing end of the press-fit connector being electrically accessible from outside the encapsulant body.
The semiconductor device of 10, wherein the one or more semiconductor dies comprise a discrete power transistor.
The semiconductor device of 13, wherein semiconductor device is configured as a power module that comprises one or more power converter circuits.
Dependencies are inferred from the claim text.