Micro device transfer head assembly
AssigneeApple Inc.
InventorsAndreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Abstract
A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
Claims20
A micro device transfer head array comprising;
- a base substrate;
- an array of mesa structures, each mesa structure including sidewalls and a top surface;
- an array of electrodes, each electrode formed on the top surface of a mesa structure;
- an array of vias through the array of mesa structures, each via connecting an electrode to an electrode lead;
- and
- a dielectric layer covering the array of mesa structures and the array of electrodes.
Dependencies are inferred from the claim text.