Photosensitive resin composition and cured film prepared therefrom
OwnerJong Han YANG, Geun HUH +2inventors
InventorsJong Han YANG, Geun HUH, Jin KWON, Jong-Ho NA
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Abstract
The present invention provides a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition includes a mixture of two or more siloxane polymers having different dissolution rates with respect to an aqueous solution of tetramethylammonium hydroxide. The composition keeps high transparency and high sensitivity, which are advantages of a composition containing a siloxane polymer, and has excellent chemical resistance, thereby providing a cured film having excellent stability in a post-processing.
Claims5
A photosensitive resin composition, comprising:
- (A) a mixture of two or more siloxane polymers having different dissolution rates with respect to an aqueous solution of tetramethylammonium hydroxide,
- (B) a 1,2-quinonediazide compound, and
- (C) an epoxy compound,
- wherein the (A) mixture of siloxane polymers comprises (A-1) a first siloxane polymer which has a dissolution rate of 400 to 2,000 Å/sec when pre-cured with respect to an aqueous solution of 2.38 wt % tetramethylammonium hydroxide;
- and (A-2) a second siloxane polymer which has a dissolution rate of 1,900 to 8,000 Å/sec when pre-cured with respect to an aqueous solution of 1.5 wt % tetramethylammonium hydroxide.
Dependencies are inferred from the claim text.