A method for processing electronic/electrical equipment component waste comprising:
- arranging a plurality of filters in a vibrating sieve machine such that the filters are adjacent to each other so as to partially overlap with each other in a feed direction of a raw material, each of the filters comprising a plurality of rods extending at distances in the feed direction of the raw material and a beam portion supporting the plurality of rods at one ends of the plurality of the rods, the other ends of the plurality of the rods being free ends;
- arranging a guide below a tip of one of the filters located on a most downstream side in the feed direction;
- feeding the raw material containing at least substrate scraps and wire scraps into the vibrating sieve machine;
- and
- sorting the substrate scraps and the wire scraps by vibrating the filters, sieving the wire scraps to an under-sieve side of the vibrating sieve machine, and capturing lumpy wire scraps with the guide.