Bubble cover to reduce noise and vibration
AssigneeGM Global Technology Operations LLC
InventorsAnil K. SACHDEV, Song HE, Arianna T. MORALES
Life of this patent
Estimating the term…
Abstract
A cover for integrated power electronics (IPE), the cover including a first sheet, a second sheet bonded to the first sheet by at least one joining point in a perimeter region, a cavity defined between the bonded first sheet and second sheet, wherein the perimeter region seals the cavity, and a filler material disposed within the cavity.
Claims19
A cover for integrated power electronics (IPE), the cover comprising:
- a first sheet;
- a second sheet bonded to the first sheet by at least one joining point in a perimeter region;
- a cavity defined between the bonded first sheet and second sheet, wherein the perimeter region seals the cavity;
- and
- a filler material disposed within the cavity,
- a first side of the cover is planar and defines a longitudinal axis, and
- the cavity extends in only a single direction from the longitudinal axis of the cover, the cavity extending towards an upper surface of the cover and away from a noise source, such that the first side faces the noise source, the noise source being inside of an assembly the cover is configured to close over.
(canceled)
(canceled)
An integrated power electronics (IPE) and engine assembly comprising:
- an engine;
- a compartment housing an IPE, the housing including a cover, the cover including
- a first sheet;
- a second sheet bonded to the first sheet by a plurality of bonds disposed in at least a portion of a perimeter region;
- a cavity formed within the perimeter region;
- and
- a filler material disposed within the cavity, wherein the filler material is a noise dampening material,
- a first side of the cover is planar and defines a longitudinal axis, and
- the cavity extends in only a single direction from the longitudinal axis of the cover, the cavity extending towards an upper surface of the cover and away from the IPE, such that the first side faces the IPE.
(canceled)
(canceled)
A method of forming a cover for integrated power electronics (IPE), the method comprising:
- forming at least one of a first sheet and a second sheet to have an irregular surface;
- joining the first and second sheets with a plurality of bonds, the irregular surface forming raised portions having cavities defined between the first and second sheets;
- filling the cavities with a filler material;
- and
- sealing the cavities with the first and second sheets,
- a first side of the cover is planar and defines a longitudinal axis, and
- the cavity extends in only a single direction from the longitudinal axis of the cover, the cavity extending towards an upper surface of the cover and away from a noise source, such that the first side faces the noise source.
Dependencies are inferred from the claim text.