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US 2023/0097273 A1Published application
Method and Drill for Removing Partial Metal Wall of Hole
AssigneeUnimicron Technology Corp.
InventorCheng-Jui Chang
Life of this patent
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AssigneeUnimicron Technology Corp.
InventorCheng-Jui Chang
Estimating the term…
The method for removing partial metal wall of hole of the present invention includes the following steps. First, a circuit board is provided. The circuit board includes a plurality of circuit layers, a plurality of dielectric layers, and a plated through hole. Each of the dielectric layers is between two adjacent circuit layers. The wall of the plated through hole includes at least one residual copper. The circuit layer immediately below the residual copper is defined as a signal layer. Next, a position of the signal layer and a position of the residual copper in the plated through hole are obtained. Next, a drill is provided, the drill includes a main body and at least one needle, and the drill is moved to the position of the residual copper. The main body is rotated around the central axis of the main body, so the needle can remove part of the residual copper.
A method for removing partial metal wall of hole, comprising:
A drill for removing partial metal wall of hole used to a circuit board, the circuit board including a plurality of circuit layers, a plurality of dielectric layers and a plated through hole, each dielectric layer disposed between two adjacent circuit layers, a wall of the plated through hole including at least one residual copper, and the position of the residual copper corresponding to the position of one or more of the dielectric layers, the drill comprising:
Dependencies are inferred from the claim text.