Method for joining dissimilar materials and joint of dissimilar materials
AssigneeDAIHEN Corporation
InventorsTomoyuki UEYAMA, Takaaki MIYAUCHI
Life of this patent
Estimating the term…
Abstract
A method for joining dissimilar materials includes forming a first recess and a second recess by irradiating a surface of a first member with laser light, the first recess and the second recess being cut into the surface obliquely at angles different from each other, and joining the second member to the surface of the first member with a part of the second member engaging with each of the first recess and the second recess by melting the part of the second member lower in melting point than the first member to cause the part of the second member to flow into each of the first recess and the second recess and solidifying the part of the second member.
Claims7
A method for joining dissimilar materials, comprising:
- forming a first recess and a second recess by irradiating a surface of a first member with laser light, the first recess and the second recess being cut into the surface obliquely at angles different from each other;
- and
- joining a second member to the surface of the first member with a part of the second member engaging with each of the first recess and the second recess by melting the part of the second member lower in melting point than the first member to cause the part of the second member to flow into each of the first recess and the second recess and solidifying the part of the second member.
A joint of dissimilar materials, comprising:
- a first member having a first recess and a second recess cut into a surface of the first member obliquely at angles different from each other;
- and
- a second member lower in melting point than the first member and joined to the surface of the first member,
- wherein a part of the second member flows into each of the first recess and the second recess to engage with each of the first recess and the second recess.
Dependencies are inferred from the claim text.