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US 2023/0078286 A1Published application
Magnetic resin composition, cured product, and electronic component
AssigneeFUJIFILM Corporation
InventorTatsuo Mikami
Life of this patent
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Abstract
Provided are a magnetic resin composition including magnetic particles and an epoxy resin having an epoxy equivalent of 400 g/eq or more, in which a filling rate of the magnetic particles is 70% or more on an area basis; a cured product obtained by curing the magnetic resin composition; and an electronic component including the cured product.
Claims19
A magnetic resin composition comprising:
- magnetic particles;
- and
- an epoxy resin having an epoxy equivalent of 400 g/eq or more,
- wherein a filling rate of the magnetic particles is 70% or more on an area basis.
1 more element
Dependencies are inferred from the claim text.