Semiconductor module
AssigneeFuji Electric Co., Ltd.
InventorKousuke KOMATSU
Life of this patent
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Abstract
A semiconductor module includes: an insulation layer; a semiconductor element that includes a main electrode and is mounted on the insulation layer; a wiring member that is electrically connected to the main electrode of the semiconductor element; a first resin that encases the semiconductor element and the wiring member; and a second resin that covers a part of the wiring member. A thermal decomposition temperature or a melting point of the second resin is greater than a maximum of guaranteed operating temperature of the semiconductor element and is less than a thermal decomposition temperature or a melting point of the first resin.
Claims17
A semiconductor module comprising:
- an insulation layer;
- a semiconductor element that includes a main electrode and is mounted on the insulation layer;
- a wiring member that is electrically connected to the main electrode of the semiconductor element;
- a first resin that encases the semiconductor element and the wiring member;
- and
- a second resin that covers a part of the wiring member,
- wherein a thermal decomposition temperature or a melting point of the second resin is greater than a maximum of guaranteed operating temperature of the semiconductor element and is less than a thermal decomposition temperature or a melting point of the first resin.
Dependencies are inferred from the claim text.