# US 2023/0069331 A1 · Electronic control device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2023/0069331 A1 - Document ID: US20230069331A1 - Status: Published application - Kind: A1 - Application number: 17/794,479 - Filed: 2020-12-11 - Published: 2023-03-02 - Earliest claimed: 2020-01-22 - Assignees: Hitachi Astemo, Ltd. - Applicants: Hitachi Astemo, Ltd. - Inventors: Minami TERANISHI; Shinya KAWAKITA; Hideyuki SAKAMOTO - Web page: https://patentgrep.com/patent/US20230069331A1 ## CPC - H05K 7/20409: {Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing} - H05K 7/20445: {the coupling element being an additional piece, e.g. thermal standoff} - G06F 1/16: Constructional details or arrangements - G06F 1/20: Cooling means - H05K 7/20418: {the radiating structures being additional and fastened onto the housing} - H05K 7/20854: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20863 takes precedence)} - H05K 9/0026: {integrally formed from metal sheet} - H10W 40/00: Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) - H10W 40/10: Arrangements for heating - H10W 76/17: characterised by their materials - H10W 99/00: Subject matter not provided for in other groups of this subclass - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An electronic control device includes an enclosure including a first enclosure having an assembly opening and a second enclosure covering the entire assembly opening, the enclosure having a communication opening communicating with the assembly opening; a circuit board accommodated in the enclosure; an integrated circuit element mounted on the circuit board; and a heat dissipating shield member thermally coupled to the integrated circuit element and grounded, wherein the heat dissipating shield member includes an inner portion accommodated inside the enclosure and thermally coupled to the integrated circuit element and an outer portion extending to an outside of the enclosure via the communication opening. ## Claims ### Claim 1 An electronic control device comprising: an enclosure including a first enclosure having an assembly opening and a second enclosure covering the entire assembly opening, the enclosure having a communication opening communicating with the assembly opening; a circuit board accommodated in the enclosure; an integrated circuit element mounted on the circuit board; and a heat dissipating shield member thermally coupled to the integrated circuit element and grounded, wherein the heat dissipating shield member includes an inner portion accommodated inside the enclosure and thermally coupled to the integrated circuit element and an outer portion extending to an outside of the enclosure via the communication opening. ### Claim 2 (depends on 1) The electronic control device according to claim 1, wherein the heat dissipating shield member including the inner portion and the outer portion is formed of a metal member as one member. ### Claim 3 (depends on 1) The electronic control device according to claim 1, wherein the enclosure has a pair of side portions each having the communication opening communicating with the assembly opening, and the heat dissipating shield member has a pair of the outer portions each extending from the communication opening to an outside of the enclosure. ### Claim 4 (depends on 1) The electronic control device according to claim 1, further comprising: a connector connected to the circuit board, wherein the connector is exposed to an outside through an opening provided in the enclosure, and the inner portion of the heat dissipating shield member includes a shield portion electrically connected to a ground portion provided on the circuit board between the integrated circuit element and the connector. ### Claim 5 (depends on 4) The electronic control device according to claim 4, further comprising: a gasket having flexibility and electrically connecting the shield portion and the ground portion of the circuit board between the shield portion of the heat dissipating shield member and the ground portion of the circuit board. ### Claim 6 (depends on 5) The electronic control device according to claim 5, wherein an area obtained by projecting the circuit board on a plane parallel to a bottom face of the first enclosure from a direction perpendicular to the plane is larger than an area obtained by projecting the circuit board on a plane parallel to a bottom face of the second enclosure, and an area occupied by the circuit board in the first enclosure is larger than an area occupied by the circuit board in the second enclosure, and the connector is provided in the second enclosure. ### Claim 7 (depends on 5) The electronic control device according to claim 5, wherein the connector is fixed to the second enclosure, and at least part of the circuit board is fitted into a groove provided in the first enclosure. ### Claim 8 (depends on 5) The electronic control device according to claim 5, wherein the shield portion of the heat dissipating shield member is disposed on a line identical to an end portion, of the communication opening, toward the connector, or disposed closer to the connector than an end portion, of the communication opening, toward the connector. ### Claim 9 (depends on 1) The electronic control device according to claim 1, wherein an area of the heat dissipating shield member is larger than an area of the communication opening provided in the enclosure. ### Claim 10 (depends on 1) The electronic control device according to claim 1, wherein the first enclosure is formed of resin containing metal or a conductive filler, or a material containing metal. ### Claim 11 (depends on 1) The electronic control device according to claim 1, wherein the second enclosure is formed of resin containing metal or a conductive filler, or a material containing metal. ### Claim 12 (depends on 1) The electronic control device according to claim 1, wherein the outer portion of the heat dissipating shield member includes an attachment portion attached to a vehicle.