# US 2023/0069327 A1 · Packaged surface acoustic wave device with conductive pillar > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2023/0069327 A1 - Document ID: US20230069327A1 - Status: Published application - Kind: A1 - Application number: 17/816,982 - Filed: 2022-08-02 - Published: 2023-03-02 - Earliest claimed: 2021-08-27 - Assignees: Skyworks Solutions, Inc. - Applicants: Skyworks Solutions, Inc. - Inventors: Hironori Fukuhara; Rei Goto; Keiichi Maki - Web page: https://patentgrep.com/patent/US20230069327A1 ## CPC - H03H 9/25: Constructional features of resonators using surface acoustic waves {(devices for manipulating acoustic surface waves in general G10K11/36)} - H03H 3/08: for the manufacture of resonators or networks using surface acoustic waves - H03H 9/02574: {of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate} - H03H 9/1071: {the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device} - H03H 9/1092: {the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's} - H03H 9/145: for networks using surface acoustic waves - H03H 9/64: using surface acoustic waves - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) ## Abstract A packaged surface acoustic wave device is disclosed. the packaged surface acoustic wave device can include a support substrate that includes a conductive via formed therein, a piezoelectric layer over the support substrate, an interdigital transducer electrode over the piezoelectric layer, a roof structure over the interdigital transducer electrode, and a conductive pillar between the support substrate and the roof structure. The conductive pillar supports the roof structure and defines at least a portion of an electrical pathway between the interdigital transducer electrode and the conductive via. The roof structure is configured such that there is no signal communication between the conductive pillar and the roof structure. ## Claims ### Claim 1 A packaged surface acoustic wave device comprising: a support substrate having a conductive via formed therein; a piezoelectric layer over the support substrate; an interdigital transducer electrode over the piezoelectric layer; a roof structure over the interdigital transducer electrode; and a conductive pillar disposed between the support substrate and the roof structure, the conductive pillar supporting the roof structure and defining at least a portion of an electrical pathway between the interdigital transducer electrode and the conductive via. ### Claim 2 (depends on 1) The packaged surface acoustic wave device of claim 1 wherein the roof structure is configured such that there is no signal communication between the conductive pillar and the roof structure, and the roof structure does not include any electronic component mounted thereon. ### Claim 3 (depends on 1) The packaged surface acoustic wave device of claim 1 wherein the roof structure and the support substrate includes the same material. ### Claim 4 (depends on 1) The packaged surface acoustic wave device of claim 1 wherein the roof structure includes resin. ### Claim 5 (depends on 1) The packaged surface acoustic wave device of claim 1 further comprising a dielectric layer disposed between the support substrate and the piezoelectric layer. ### Claim 6 (depends on 1) The packaged surface acoustic wave device of claim 1 further comprising a conductive structure disposed between and connecting the interdigital transducer electrode and the conductive pillar. ### Claim 7 (depends on 6) The packaged surface acoustic wave device of claim 6 further comprising a second interdigital transducer electrode over the piezoelectric layer. ### Claim 8 (depends on 7) The packaged surface acoustic wave device of claim 7 further comprising a second conductive structure electrically connecting the interdigital transducer electrode and the second interdigital transducer electrode. ### Claim 9 (depends on 8) The packaged surface acoustic wave device of claim 8 further comprising a second conductive pillar disposed between the second conductive structure and the roof structure, the second conductive pillar configured to dissipate heat generated by the interdigital transducer electrode. ### Claim 10 (depends on 9) The packaged surface acoustic wave device of claim 9 further comprising a third conductive pillar supporting the roof structure relative to the support substrate and a third conductive structure electrically connecting the second interdigital transducer electrode and the third conductive pillar, the support substrate including a second conductive via formed therein, the third conductive pillar defining at least a portion of an electrical pathway between the second interdigital transducer electrode and the second conductive via. ### Claim 11 (depends on 1) The packaged surface acoustic wave device of claim 1 wherein the interdigital transducer electrode is positioned in a cavity defined between the support substrate and the roof structure, the cavity is sealed by a cavity seal disposed laterally around the interdigital transducer electrode. ### Claim 12 (depends on 11) The packaged surface acoustic wave device of claim 11 wherein the conductive pillar and the cavity seal includes the same material. ### Claim 13 (depends on 1) The packaged surface acoustic wave device of claim 1 wherein the piezoelectric layer is partially disposed over the support substrate. ### Claim 14 (depends on 1) The packaged surface acoustic wave device of claim 1 wherein the conductive via extends vertically through the support substrate, and a maximum horizontal dimension of the conductive pillar being greater than a maximum horizontal dimension of the conductive via. ### Claim 15 A packaged surface acoustic wave device comprising: a multilayer piezoelectric substrate having a via formed therein, the multilayer piezoelectric substrate including a support substrate and a piezoelectric layer over the support substrate; an interdigital transducer electrode over the piezoelectric layer; a roof structure over the interdigital transducer electrode; and a conductive support structure disposed between the multilayer piezoelectric substrate and the roof structure, the conductive support structure supporting the roof structure and defining at least a portion of an electrical pathway between the interdigital transducer electrode and the conductive via. ### Claim 16 (depends on 15) The packaged surface acoustic wave device of claim 15 wherein the roof structure is configured such that there is no signal communication between the conductive support structure and the roof structure, the roof structure does not include any electronic component mounted thereon, and the roof structure and the support substrate includes the same material. ### Claim 17 (depends on 15) The packaged surface acoustic wave device of claim 15 wherein the interdigital transducer electrode is positioned in a cavity defined between the support substrate and the roof structure, the cavity is sealed by a cavity seal disposed laterally around the interdigital transducer electrode. ### Claim 18 A packaged surface acoustic wave device comprising: a support substrate having a conductive via formed therein; a piezoelectric layer over the support substrate; an interdigital transducer electrode over the piezoelectric layer; a nonconductive roof structure over the interdigital transducer electrode; and a conductive pillar disposed between the support substrate and the nonconductive roof structure, the conductive pillar supporting the nonconductive roof structure, the conductive pillar is nonelectrically coupled with the roof structure. ### Claim 19 (depends on 18) The packaged surface acoustic wave device of claim 18 wherein the conductive pillar defines at least a portion of an electrical pathway between the interdigital transducer electrode and the conductive via. ### Claim 20 (depends on 19) The packaged surface acoustic wave device of claim 19 wherein the nonconductive roof structure is configured such that there is no signal communication between the conductive pillar and the roof structure.