# US 2023/0069147 A1 · 3d-printed ceramics with conductor infusion for ultra-high-speed electronics > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2023/0069147 A1 - Document ID: US20230069147A1 - Status: Published application - Kind: A1 - Application number: 17/459,230 - Filed: 2021-08-27 - Published: 2023-03-02 - Earliest claimed: 2021-08-27 - Assignees: Schlumberger Technology Corporation - Applicants: Schlumberger Technology Corporation - Inventors: John Michael Beshears; Steven O. Dunford - Web page: https://patentgrep.com/patent/US20230069147A1 ## CPC - B33Y 10/00: Processes of additive manufacturing - H05K 3/4608: {comprising an electrically conductive base or core} - B33Y 80/00: Products made by additive manufacturing - H05K 1/053: {the metal substrate being covered by an inorganic insulating layer} - H05K 1/114: {Pad being close to via, but not surrounding the via} - H05K 1/16: incorporating printed electric components, e.g. printed resistors, capacitors or inductors - H05K 3/0014: {Shaping of the substrate, e.g. by moulding} - H05K 3/101: {by casting or moulding of conductive material} - H05K 3/1291: {Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets} - H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass} - H05K 3/4061: {for via connections in inorganic insulating substrates} - H05K 2203/128: Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder - B33Y: ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract The disclosure provides for methods of making electrically conductive apparatus, such as circuit boards. The methods include 3D-printing a ceramic material into a ceramic substrate that includes a void. A conductive material is infused into the void. The conductive materiel forms electrically conductive connections within the apparatus. Also disclosed are apparatus formed by the methods. ## Claims ### Claim 1 A method of making an electrically conductive apparatus, the method comprising: 3D-printing a ceramic material into a ceramic substrate, the ceramic substrate including a void; infusing a material into the void; and retrieving the ceramic substrate with the material within the void, wherein the material is electrically conductive. ### Claim 2 (depends on 1) The method of claim 1, wherein the material is molten when infused into the void, the method further comprising solidifying the material within the void. ### Claim 3 (depends on 1) The method of claim 1, wherein infusing the material into the void comprises infusing metal into the void. ### Claim 4 (depends on 1) The method of claim 1, wherein infusing the material into the void comprises introducing a solution comprising the material into the void. ### Claim 5 (depends on 1) The method of claim 1, wherein the void is a hole through the ceramic substrate, a cavity in the ceramic substrate, or a channel in the ceramic substrate. ### Claim 6 (depends on 1) The method of claim 1, wherein the ceramic substrate includes a plurality of voids, and wherein the material defines an electrically conductive wiring assembly of the electrically conductive apparatus. ### Claim 7 (depends on 1) The method of claim 1, wherein the material forms a conductive trace, lead, or via. ### Claim 8 (depends on 1) The method of claim 1, wherein the void has a curvilinear extension. ### Claim 9 (depends on 1) The method of claim 1, wherein infusing the material into the void comprises inserting the ceramic substrate into a source of the material, depositing the material onto the ceramic substrate, or injecting the material into the void. ### Claim 10 (depends on 1) The method of claim 1, wherein infusing the material into the void comprises applying a force to the material and ceramic substrate forcing the material into the void. ### Claim 11 (depends on 10) The method of claim 10, wherein applying the force includes applying centripetal force, applying a vacuum, or applying positive pressure. ### Claim 12 (depends on 1) The method of claim 1, further comprising, prior to infusing the material into the void, applying a surface treatment to the ceramic substrate. ### Claim 13 (depends on 12) The method of claim 12, wherein the surface treatment comprises applying a precursor to the ceramic substrate that encourages wicking of the material along a surface of the ceramic substrate, applying a substance to the ceramic substrate that promotes adherence of the material to the ceramic substrate, applying a resist to the ceramic substrate that resists adherence of the material onto the ceramic substrate, or combinations thereof. ### Claim 14 (depends on 12) The method of claim 12, further comprising, prior to applying the surface treatment, masking portions of the ceramic substrate. ### Claim 15 (depends on 1) The method of claim 1, further comprising, after infusing the material into the void, removing air pockets from the void, removing contaminants from the void, or combinations thereof, wherein the removing includes agitating the ceramic substrate, applying a vacuum to the ceramic substrate, or applying positive pressure to the ceramic substrate. ### Claim 16 (depends on 1) The method of claim 1, wherein the ceramic material comprises Zirconia, Alumina, Aluminum Nitride, Silicate, Silicon Nitride, synthetic quartz, or fused silica. ### Claim 17 (depends on 1) The method of claim 1, wherein the material comprises an electrically conductive metal. ### Claim 18 (depends on 1) The method of claim 1, wherein the material comprises an electrically conductive non-metal. ### Claim 19 (depends on 1) The method of claim 1, wherein infusing the material into the void comprises infusing the material through a channel within a segment of the ceramic substrate, wherein the channel is fluidly coupled with the void, and wherein, after the infusing, the segment is removed from a remainder of the ceramic substrate. ### Claim 20 A method of making an electrically conductive apparatus, the method comprising: 3D-printing a first ceramic material into a first portion of a ceramic substrate, the first portion of the ceramic substrate including a first void; infusing a first material into the first void; forming a second portion of the ceramic substrate by 3D-printing a second ceramic material onto the first portion of the ceramic substrate, the second portion of the ceramic substrate including a second void; infusing a second material into the second void; and retrieving the ceramic substrate with the first and second material within the first and second voids, wherein the first and second materials are electrically conductive materials. ### Claim 21 (depends on 20) The method of claim 20, the first ceramic material and the second ceramic material are the same material. ### Claim 22 (depends on 20) The method of claim 20, wherein the first material and the second material are the same materials. ### Claim 23 (depends on 20) The method of claim 20, wherein the first void and the second void are coupled in the ceramic substrate. ### Claim 24 A circuit board, the circuit board comprising: a ceramic substrate, the ceramic substrate including a plurality of voids; and an electrically conductive material within the plurality of voids, wherein the electrically conductive material defines an electrically conductive wiring assembly of the circuit board, the electrically conductive wiring assembly comprising a via, and wherein the circuit board lacks capture pads. ### Claim 25 (depends on 24) The circuit board of claim 24, wherein at least one of the plurality of voids has a curvilinear extension. ### Claim 26 (depends on 24) The circuit board of claim 24, wherein the circuit board comprises a first electrical component positioned on a first surface of the circuit board and a second electrical component positioned on a second surface of the circuit board, wherein the first and second surfaces are different surfaces of the circuit board, and wherein the first and second electrical components are electrically coupled through the electrically conductive wiring assembly. ### Claim 27 (depends on 26) The circuit board of claim 26, wherein the first electrical component is a transmitter and the second electrical component is a receiver.