Methods and apparatus to thermally actuate microelectromechanical structures devices
OwnerBichoy Bahr, Adam Fruehling +1inventors
InventorsBichoy Bahr, Adam Fruehling, Scott Summerfelt
Life of this patent
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Abstract
An example microelectromechanical structures (MEMS) switch includes a body having a first end and a second end opposite the first end. The body extends from a base at the first end and has a first width. The MEMS switch further includes a bridge extending laterally from the body at the second end, and a spine extending between the bridge and the base. The spine has a second width smaller than the first width. At least one of the spine or the body includes a first material with a first thermal coefficient and a second material with a second thermal coefficient different from the first thermal coefficient.
Claims21
A microelectromechanical structures (MEMS) switch comprising:
- a body having a first end and a second end opposite the first end, the body extending from a base at the first end and having a first width;
- a bridge extending laterally from the body at the second end;
- and
- a spine extending between the bridge and the base, the spine having a second width smaller than the first width, at least one of the spine or the body including a first material with a first thermal coefficient and a second material with a second thermal coefficient different from the first thermal coefficient.
An apparatus comprising:
- a microelectromechanical structures (MEMS) switch circuit having an output and an input,
- a contact pad;
- a body configured to be movable to toggle the MEMS switch circuit between on and off states based on the body contacting the contact pad, the body supporting a bridge that extends laterally therefrom, the body having a first width;
- and
- a spine extending from the bridge, the spine having a second width smaller than the first width, the spine configured to be heated when current passes therethrough to cause a thermal coefficient mismatch of at least one of the body or the spine to move the body relative to the contact pad.
A system comprising:
- a contact pad of a microelectromechanical structures (MEMS) switch;
- a base;
- a body positioned between the base and the contact pad, the body configured to move toward and contact the contact pad to electrically couple the contact pad to the base, the body having a first width;
- a spine extending from a bridge that extends laterally from the body, the spine having a second width smaller than the first width, at least one of the body or the spine having a first material with a first thermal coefficient and a second material with a second thermal coefficient different from the first thermal coefficient to define a thermal coefficient mismatch therebetween;
- and
- a current source configured to cause current to pass through the spine and heat the spine to move the body relative to the contact pad based on the thermal coefficient mismatch.
Dependencies are inferred from the claim text.