# US 2023/0067973 A1 · Apparatus for treating substrate and method for treating a substrate

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- Number: US 2023/0067973 A1
- Document ID: US20230067973A1
- Status: Published application
- Kind: A1
- Application number: 17/901,941
- Filed: 2022-09-02
- Published: 2023-03-02
- Earliest claimed: 2021-09-02
- Assignees: Semes Co., Ltd.
- Applicants: Semes Co., Ltd.
- Inventors: Tae Hee KIM; Ki Hoon CHOI; Hyun YOON; Won Sik SON; Hyo Won YANG; In Ki JUNG
- Web page: https://patentgrep.com/patent/US20230067973A1

## CPC

- G03F 1/44: Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
- G03F 1/66: Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
- B08B 3/022: {Cleaning travelling work (B08B3/042 takes precedence)}
- B08B 13/00: Accessories or details of general applicability for machines or apparatus for cleaning
- G03F 1/60: Substrates
- G03F 1/84: Inspecting
- H10P 72/0406: {for cleaning followed by drying, rinsing, stripping, blasting or the like}
- H10P 72/0414: {using mainly spraying means, e.g. nozzles}
- H10P 72/0436: {mainly by radiation}
- H10P 72/0464: {characterised by the construction of the transfer chamber}
- H10P 72/3302: {Mechanical parts of transfer devices}
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- B08B: CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

The inventive concept provides a mask treating apparatus. The mask treating apparatus includes a support unit configured to support and rotate a mask, the mask having a first pattern within a plurality of cells thereof and a second pattern outside regions of the plurality of cells; and a heating unit having a laser irradiator for irradiating a laser light to a specific region of the mask supported on the support unit, and a controller configured to control the support unit and the heating unit, and wherein the support unit includes: a support part for supporting the mask; and a moving stage part configured to move a position of the support part, and wherein the controller controls the moving stage part so a position of the mask supported on the support part is changed so the second pattern is positioned at the specific region.

## Claims

### Claim 1

A mask treating apparatus comprising:
a support unit configured to support and rotate a mask, the mask having a first pattern within a plurality of cells thereof and a second pattern outside regions of the plurality of cells; and
a heating unit having a laser irradiator for irradiating a laser light to a specific region of the mask supported on the support unit, and
a controller configured to control the support unit and the heating unit, and
wherein the support unit comprises:
a support part for supporting the mask; and
a moving stage part configured to move a position of the support part, and wherein the controller controls the moving stage part so a position of the mask supported on the support part is changed so the second pattern is positioned at the specific region.

### Claim 2 (depends on 1)

The mask treating apparatus of claim 1, wherein the support unit further comprises a rotation part configured to rotate the moving stage part, and wherein the controller controls the rotation part so the mask stop rotation while the laser light is being irradiated by the laser irradiator to the second pattern.

### Claim 3 (depends on 2)

The mask treating apparatus of claim 2 further comprising a liquid supply unit configured to supply a treating liquid to the mask supported on the support unit, and
wherein the controller controls the rotation part so the mask is rotated while the liquid supply unit is supplying the treating liquid to the mask.

### Claim 4 (depends on 1)

The mask treating apparatus of claim 1, wherein the moving stage part comprises:
a base positioned below the support part;
a first driving part installed at the base and moving the support part in a first direction which is horizontal to the ground; and
a second driving part installed at the base and moving the support part in a second direction which is orthogonal to the first direction and horizontal to the ground.

### Claim 5 (depends on 3)

The mask treating apparatus of claim 3 further comprising a container having a treating space for treating the mask and a recollecting path for recollecting the treating liquid, and
wherein the support unit supports the substrate at the treating space.

### Claim 6 (depends on 1)

The mask treating apparatus of claim 1, wherein a position of the laser irradiator is fixed while the laser irradiator irradiates the laser light.

### Claim 7 (depends on 1)

The mask treating apparatus of claim 1, wherein a process for minimizing a deviation between a critical dimension of the first pattern and a critical dimension of the second pattern by irradiating the laser light with respect to the second pattern is performed.

### Claim 8 (depends on 1)

The mask treating apparatus of claim 1, wherein regarding a first pattern and a second pattern provided at each cell, the first pattern is a monitoring pattern of an exposing pattern formed at a cell and the second pattern is a condition setting pattern of the mask treating apparatus.

### Claim 9

A substrate treating apparatus comprising:
a support unit configured to support and rotate a substrate at which a pattern is formed;
a heating unit configured to heat a specific region of the substrate;
a controller configured to control the support unit and the heating unit, and
wherein the support unit comprises:
a support part for supporting the substrate; and
a moving stage part configured to change a position of the support part, and
wherein the controller controls the moving state unit so a position of the substrate supported on the support unit is changed so a specific pattern among the pattern is positioned at the specific region.

### Claim 10 (depends on 9)

The substrate treating apparatus of claim 9, wherein the support unit further comprises a rotation part configured to rotate the moving stage part, and
wherein the controller controls the rotation part so the substrate does not rotate while the heating unit heats the specific pattern.

### Claim 11 (depends on 10)

The substrate treating apparatus of claim 10 further comprising a liquid supply unit for supplying a treating liquid to the substrate supported on the support unit, and
wherein the controller controls the rotation part so the substrate is rotated while the liquid supply unit is supplying the treating liquid to the substrate.

### Claim 12 (depends on 9)

The substrate treating apparatus of claim 9, wherein the moving stage part comprises:
a base positioned below the support part;
a first driving part installed at the base and moving the support part in a first direction which is horizontal to the ground; and
a second driving part installed at the base and moving the support part in a second direction which is orthogonal to the first direction and horizontal to the ground.

### Claim 13 (depends on 9)

The substrate treating apparatus of claim 9, wherein the heating unit includes a laser irradiator irradiating a laser light to the specific pattern, and a position of the laser irradiator is fixed while the laser irradiator irradiates the laser light.

### Claim 14 (depends on 13)

The substrate treating apparatus of claim 13, wherein a process for minimizing a deviation between a critical dimension of the specific pattern and a critical dimension of a pattern aside from the specific pattern by irradiating the laser light with respect to the specific pattern is performed.

### Claim 15 (depends on 14)

The substrate treating apparatus of claim 14, wherein the specific pattern is a condition setting pattern of the substrate treating apparatus.

### Claim at position 16

16-20. (canceled)