# US 2023/0066801 A1 · Electronic device

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- Number: US 2023/0066801 A1
- Document ID: US20230066801A1
- Status: Published application
- Kind: A1
- Application number: 17/901,835
- Filed: 2022-09-01
- Published: 2023-03-02
- Earliest claimed: 2021-09-02
- Assignees: Inventec (Pudong) Technology Corporation; Inventec Corporation
- Applicants: Inventec (Pudong) Technology Corp.; Inventec Corporation
- Inventors: Chun-Chi Lin; Szu-Yu Huang; I-Fang Chen; Ya-lan Kuo
- Web page: https://patentgrep.com/patent/US20230066801A1

## CPC

- H05K 7/20145: {Means for directing air flow, e.g. ducts, deflectors, plenum or guides}
- G06F 1/1616: {with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position}
- G06F 1/1656: {Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203)}
- G06F 1/203: {for portable computers, e.g. for laptops}
- H05K 7/20154: {Heat dissipaters coupled to components}
- H05K 1/0201: {Thermal arrangements, e.g. for cooling, heating or preventing overheating}
- H05K 2201/09063: Holes or slots in insulating substrate not used for electrical connections
- Y02D 10/00: Energy efficient computing, e.g. low power processors, power management or thermal management
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- Y02D: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE

## Abstract

An electronic device includes a base, a circuit board and a heat dissipating module. The base includes a bottom cover and a frame. The frame is disposed on the bottom cover. An accommodating space is between the bottom cover and the frame. The bottom cover has an air inlet. The circuit board is disposed in the accommodating space. The circuit board has a through hole. The through hole corresponds to the air inlet. The heat dissipating module is disposed in the accommodating space and located above the circuit board. The heat dissipating module includes a fan. The fan corresponds to the through hole. The fan drives airflow to flow into the accommodating space from the air inlet and the through hole along an axial direction of the fan and then flow out of the base from the accommodating space along the axial direction of the fan.

## Claims

### Claim 1

An electronic device comprising:
a base comprising a bottom cover and a frame, the frame being disposed on the bottom cover, an accommodating space being between the bottom cover and the frame, the bottom cover having an air inlet;
a circuit board disposed in the accommodating space, the circuit board having a through hole, a position of the through hole corresponding to a position of the air inlet; and
a heat dissipating module disposed in the accommodating space and located above the circuit board, the heat dissipating module comprising a fan, a position of the fan corresponding to the position of the through hole;
wherein the fan drives airflow to flow into the accommodating space from the air inlet and the through hole along an axial direction of the fan and then flow out of the base from the accommodating space along the axial direction of the fan.

### Claim 2 (depends on 1)

The electronic device of claim 1, further comprising an electronic component disposed on the circuit board, the heat dissipating module further comprising a heat dissipating fin set, a position of the heat dissipating fin set corresponding to a position of the electronic component.

### Claim 3 (depends on 2)

The electronic device of claim 2, further comprising a heat conducting medium disposed on the electronic component and abutting against the heat dissipating fin set.

### Claim 4 (depends on 2)

The electronic device of claim 2, further comprising a plurality of fixing members, the heat dissipating fin set comprising a plurality of fixing pillars, the fixing members passing through the circuit board and the fixing pillars to be fixed to the frame.

### Claim 5 (depends on 1)

The electronic device of claim 1, wherein the base further comprises a keyboard movably disposed on the frame and located above the accommodating space; when the keyboard is closed with respect to the frame, the keyboard shields the heat dissipating module; when the keyboard is lifted with respect to the frame, a gap is formed between the keyboard and the heat dissipating module.

### Claim 6 (depends on 5)

The electronic device of claim 5, wherein the base further comprises a lift mechanism configured to drive the keyboard to be lifted or closed with respect to the frame.

### Claim 7 (depends on 1)

The electronic device of claim 1, wherein the base further comprises a keyboard disposed on the frame and staggered with the heat dissipating module.

### Claim 8 (depends on 7)

The electronic device of claim 7, wherein the base further comprises a cover plate disposed on the frame and adjacent to the keyboard, the cover plate shields the heat dissipating module, and the cover plate has a plurality of air holes.

### Claim 9 (depends on 1)

The electronic device of claim 1, further comprising a display device pivotally connected to the base.