# US 2023/0066652 A1 · Semiconductor device packaging warpage control > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2023/0066652 A1 - Document ID: US20230066652A1 - Status: Published application - Kind: A1 - Application number: 17/412,327 - Filed: 2021-08-26 - Published: 2023-03-02 - Earliest claimed: 2021-08-26 - Assignees: NXP USA, Inc. - Applicants: NXP USA, Inc. - Inventors: Vivek Gupta; Michael B. Vincent; Scott M. Hayes; Richard Te Gan; Zhiwei Gong - Web page: https://patentgrep.com/patent/US20230066652A1 ## CPC - H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)} - H10W 70/027: {Mechanical treatments, e.g. deforming, punching or cutting} - H10W 70/68: Shapes or dispositions thereof - H10W 74/014: {using batch processing} - H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)} - H10W 99/00: Subject matter not provided for in other groups of this subclass - H10P 72/74: {using temporarily an auxiliary support} - H10P 72/7418: {of passive members, e.g. a chip mounting substrate} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A method of manufacturing a carrier for semiconductor device packaging is provided. The method includes forming a carrier having a plurality of plateau regions separated by a plurality of channels. The carrier is configured and arranged to support a plurality of semiconductor die during a packaging operation. The plurality of channels is filled with a material configured to control warpage of the carrier. ## Claims ### Claim 1 A method comprising: forming a carrier having a plurality of plateau regions separated by a plurality of channels, the carrier configured and arranged to support a plurality of semiconductor die during a packaging operation; and filling the plurality of channels with a structural material, the structural material configured to control warpage of the carrier. ### Claim 2 (depends on 1) The method of claim 1, wherein a top surface of the structural material is substantially coplanar with a top surface of the plurality of plateau regions. ### Claim 3 (depends on 1) The method of claim 1, wherein forming the carrier further comprises removing carrier material to form the plurality of channels. ### Claim 4 (depends on 3) The method of claim 3, wherein the carrier material is removed by way of etching, sawing, laser ablation, or a combination thereof. ### Claim 5 (depends on 1) The method of claim 1, wherein forming the carrier further comprises adding material to a base portion of the carrier, the added material configured to form the plurality of plateau regions. ### Claim 6 (depends on 5) The method of claim 5, wherein the added material comprises a material different from the base portion of the carrier. ### Claim 7 (depends on 1) The method of claim 1, wherein the structural material has a coefficient of thermal expansion sufficient to maintain a substantially planar condition of the carrier during the packaging operation. ### Claim 8 (depends on 1) The method of claim 1, wherein the carrier comprises a metal, glass, quartz, or ceramic material. ### Claim 9 (depends on 1) The method of claim 1, wherein the carrier is further configured for attaching, by way of a releasable adhesive, the plurality of semiconductor die to the plurality of plateau regions during the packaging operation. ### Claim 10 An apparatus for manufacturing a packaged semiconductor device, the apparatus comprising: a carrier having a plurality of plateau regions separated by a plurality of channels, the carrier configured and arranged to support a plurality of semiconductor die during a packaging operation; and a structural material disposed in the plurality of channels, the structural material configured to control warpage of the carrier. ### Claim 11 (depends on 10) The apparatus of claim 10, wherein a top surface of the structural material is substantially coplanar with a top surface of the plurality of plateau regions. ### Claim 12 (depends on 10) The apparatus of claim 10, wherein the plurality of channels are formed in the carrier by way of etching, sawing, laser ablation, or a combination thereof. ### Claim 13 (depends on 10) The apparatus of claim 10, wherein the structural material has a coefficient of thermal expansion sufficient to maintain a substantially planar condition of the carrier during the packaging operation. ### Claim 14 (depends on 10) The apparatus of claim 10, wherein the plurality of plateau regions comprises a material different from a base portion of the carrier. ### Claim 15 (depends on 10) The apparatus of claim 10, wherein the carrier comprises a metal, glass, quartz, or ceramic material. ### Claim 16 A method comprising: forming a carrier having a plurality of vertical channels and a plurality of horizontal channels, the plurality of vertical channels and the plurality of horizontal channels configured and arranged to separate a plurality of plateau regions of the carrier; and filling the plurality of vertical channels and the plurality of horizontal channels with a structural material, the structural material configured to control warpage of the carrier during a packaging operation. ### Claim 17 (depends on 16) The method of claim 16, wherein the carrier is configured and arranged to support a plurality of semiconductor die during the packaging operation. ### Claim 18 (depends on 16) The method of claim 16, wherein forming the carrier further comprises removing carrier material by way of etching, sawing, laser ablation, or a combination thereof to form the plurality of vertical channels and the plurality of horizontal channels. ### Claim 19 (depends on 16) The method of claim 16, wherein a top surface of the structural material is substantially coplanar with a top surface of the plurality of plateau regions. ### Claim 20 (depends on 16) The method of claim 16, wherein the plurality of plateau regions comprises a material different from a base portion of the carrier.