# US 2023/0066491 A1 · Device assembly, device module including the device assembly, and device package including the device module

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- Number: US 2023/0066491 A1
- Document ID: US20230066491A1
- Status: Published application
- Kind: A1
- Application number: 17/893,016
- Filed: 2022-08-22
- Published: 2023-03-02
- Earliest claimed: 2021-08-25
- Assignees: Korea Institute of Science and Technology; Research & Business Foundation Sungkyunkwan University
- Applicants: Korea Institute of Science and Technology; Research & Business Foundation Sungkyunkwan University
- Inventors: In Soo KIM; Donghee Son; Hannah Kwon; Hye Jun Kim; Duhwan Seong; Jinhyun Kim
- Web page: https://patentgrep.com/patent/US20230066491A1

## CPC

- H10F 19/804: {Materials of encapsulations}
- H10W 90/00: Package configurations
- H10K 50/844: Encapsulations
- H10K 30/88: Passivation; Containers; Encapsulations
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

Provided is a device assembly including a substrate for mounting a device thereon, electrodes provided on the substrate to be electrically connected to the device, and an encapsulation provided on the substrate and the electrodes to accommodate and encapsulate the device therein, wherein the substrate and the encapsulation are made of a self-healing polymer (SHP), and wherein the electrodes are made of a conductive polymer composite including the SHP.

## Claims

### Claim 1

A device assembly comprising:
a substrate for mounting a device thereon;
electrodes provided on the substrate to be electrically connected to the device; and
an encapsulation provided on the substrate and the electrodes to accommodate and encapsulate the device therein,
wherein the substrate and the encapsulation are made of a self-healing polymer (SHP), and
wherein the electrodes are made of a conductive polymer composite comprising the SHP.

### Claim 2 (depends on 1)

The device assembly of claim 1, wherein the substrate, the electrodes, and the encapsulation are provided in close contact with each other.

### Claim 3 (depends on 1)

The device assembly of claim 1, wherein the electrodes comprise:
a first electrode provided at an end of the substrate and extending to be in contact with the device; and
a second electrode provided at another end of the substrate.

### Claim 4 (depends on 2)

The device assembly of claim 2, wherein the first electrode is bent upward and extends to be in contact with an upper surface of the device.

### Claim 5 (depends on 1)

The device assembly of claim 1, wherein the conductive polymer composite comprises:
a matrix provided as the SHP; and
a plurality of electrical conductor clusters dispersed in the matrix, and
wherein the electrical conductor clusters comprise a metal material comprising one or more of silver (Ag), gold (Au), copper (Cu), aluminum (Al), tungsten (W), molybdenum (Mo), titanium (Ti), chromium (Cr), nickel (Ni), and platinum (Pt).

### Claim 6 (depends on 1)

A device module in which a plurality of unit modules each provided as the device assembly according to claim 1 are connected in series.

### Claim 7 (depends on 6)

The device module of claim 6, wherein the unit modules comprise:
a first unit module provided as the device assembly comprising a light-receiving device as the device; and
a second unit module provided as the device assembly comprising a light-emitting device as the device, and
wherein the second unit module is driven by electrical energy generated from the first unit module.

### Claim 8 (depends on 6)

A device package comprising:
a mounting part for mounting the device module according to claim 6 thereon; and
a case provided on the mounting part to accommodate and encapsulate the device module therein,
wherein the mounting part and the case are made of a self-healing polymer (SHP).