# US 2023/0057774 A1 · Wafer processing apparatus and wafer transfer method

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- Number: US 2023/0057774 A1
- Document ID: US20230057774A1
- Status: Published application
- Kind: A1
- Application number: 17/599,705
- Filed: 2021-04-27
- Published: 2023-02-23
- Earliest claimed: 2020-04-29
- Assignees: Changxin Memory Technologies, Inc.
- Applicants: Changxin Memory Technologies, Inc.
- Inventors: Xueyu LIANG
- Web page: https://patentgrep.com/patent/US20230057774A1

## CPC

- G03F 7/7075: {Handling workpieces outside exposure position, e.g. SMIF box}
- H10P 72/3306: {Horizontal transfer of a single workpiece}
- G03F 7/20: Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00)
- G03F 7/70525: {Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure}
- G03F 7/7085: {Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load}
- G03F 7/70991: {Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum}
- H10P 72/0441: {Apparatus for sealing, encapsulating, glassing, decapsulating or the like}
- H10P 72/0474: {comprising at least one lithography chamber}
- H10P 72/06: {Apparatus for monitoring, sorting, marking, testing or measuring}
- H10P 72/0606: {Position monitoring, e.g. misposition detection or presence detection}
- H10P 72/3202: {Mechanical details, e.g. rollers or belts}
- H10P 72/3302: {Mechanical parts of transfer devices}
- G05B 19/41815: {characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell}
- G05B 2219/2602: Wafer processing
- G05B 2219/45031: Manufacturing semiconductor wafers
- H10P 72/32: {between different workstations}
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- G05B: CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS (systems for controlling or regulating non-electric variables G05D; systems for regulating electric or magnetic variables G05F; control devices or systems insofar as characterised by mechanical features only G05G)

## Abstract

The present disclosure relates to a wafer processing apparatus and a wafer transfer method. The wafer processing apparatus includes: a first machine; a second machine, including a manipulator, the manipulator transfers a wafer to the machine through a connection port; the connection port is provided between the first machine and the second machine; door panels, provided on the first machine and used to close the connection port; a detector, for detecting a current position of the door panel; a driver, connected to the door panel, for driving the door panel to move to open or close the connection port; and a controller, connected to the detector, the driver and the manipulator, for controlling the door panel to move according to the current position of the door panel to open or close the connection port, and control the manipulator to transfer the wafer.

## Claims

### Claim 1

A wafer processing apparatus, comprising:
a first machine;
a second machine, comprising a manipulator, the manipulator transfers a wafer to the machine through a connection port; the connection port is provided between the first machine and the second machine;
door panels, provided on the first machine and used to close the connection port;
a detector, for detecting current position of the door panels;
a driver, connected to the door panels, for driving the door panels to move to open or close the connection port; and
a controller, connected to the detector, the driver and the manipulator, for controlling the door panels to move according to current position of the door panels detected by the detector so as to open or close the connection port, and control the manipulator to transfer the wafer.

### Claim 2 (depends on 1)

The wafer processing apparatus according to claim 1, the wafer processing apparatus further comprises:
a safety module, connected to the controller and the manipulator, and comprising a detection unit, for detecting an open-closed state of the connection port, when the detection unit detects that the connection port is closed, the safety module controls the manipulator to stop transferring the wafer to the first machine.

### Claim 3 (depends on 1)

The wafer processing apparatus according to claim 1, wherein the detector comprises:
a light source, connected to the controller and facing surfaces of the door panels, for projecting a detection light to the door panels under the control of the controller; and
photoresistor receivers, connected to the controller and provided on side surfaces of the door panels facing the second machine, for detecting a light signal;
the light source is provided at a preset position, such that the light projected from the preset position is received by the photoresistor receivers when the connection port is closed.

### Claim 4 (depends on 3)

The wafer processing apparatus according to claim 3, wherein there are two door panels, two door panels are respectively provided on two opposite sides of the connection port; the opening and closing of the connection port is realized by moving the two door panels;
there are two photoresistor receivers, two photoresistor receivers are provided on sides of the door panels facing the second machine, and are respectively provided on the two door panels;
the detector further comprises:
a metal sheet and an inductive switch sensor, the metal sheet and the inductive switch sensor are respectively provided on surfaces of the same side of the two door panels, the inductive switch sensor is connected to the controller; the metal sheet and the inductive switch sensor are provided oppositely; when a distance between the metal sheet and the inductive switch sensor changes, an electrical parameter output by the inductive switch sensor changes accordingly.

### Claim 5 (depends on 1)

The wafer processing apparatus according to claim 1, wherein the driver comprises:
a motor drive module, connected to the controller;
a stepping motor, connected to the motor drive module and running under the control of the motor drive module;
a driving gear, connected to the stepping motor, for rotating around a rotation axis of the driving gear under the drive of the stepping motor, the rotation axis is perpendicular to the surfaces of the door panels; and
a gear bar, mounted in cooperation with the driving gear, and moving relative to a mounting position of the driving gear when the driving gear rotates, the door panels are mounted on the gear bar and move under the drive of the gear bar.

### Claim 6 (depends on 5)

The wafer processing apparatus according to claim 5, the wafer processing apparatus further comprises:
a sliding rail, a length direction of the sliding rail coincides with a moving path of the door panel; the sliding rail is mounted on the moving path of the door panel; the door panel is mounted on the sliding rail and is capable of sliding along the length direction of the sliding rail; and
a turning wheel, fixedly mounted on the door panel, mounted in a groove of the sliding rail, and is capable of rotating in the groove of the sliding rail along the length direction of the sliding rail;
the sliding rail is provided above the door panel, the gear bar is provided below the door panel, and the driving gear is provided below the gear bar.

### Claim 7 (depends on 1)

The wafer processing apparatus according to claim 1, the wafer processing apparatus further comprises an interactive module; the interactive module comprises:
a housing;
a display unit, provided on an outer surface of the housing and connected to the controller, for displaying the open/closed state of the connection port; and
a button, provided in the housing, connected to the controller, and provided for a user to manually control the movement of the door panels so as to control the opening and closing of the connection port.

### Claim 8 (depends on 1)

The wafer processing apparatus according to claim 1, the wafer processing apparatus further comprises an alarm, connected to the controller, and comprising at least one of a buzzer and a light-emitting diode (LED) lamp.

### Claim 9 (depends on 1)

A wafer transfer method, the wafer transfer method is used for transferring a wafer between the first machine and the second machine of the wafer processing apparatus according to claim 1, the wafer transfer method comprises:
controlling the detector to detect the open-closed state of the connection port when the second machine is ready to transfer the wafer to the first machine through the connection port, and controlling the door panels to move to open the connection port when the connection port is closed.

### Claim 10 (depends on 9)

The wafer transfer method according to claim 9, there are two door panels, two door panels are respectively provided on two opposite sides of the connection port; the opening and closing of the connection port is realized by moving the two door panels; when the door panels are controlled to move to open the connection port, the wafer transfer method further comprises:
controlling the detector to detect a distance between the two door panels, and when the distance between the two door panels is within a preset range, controlling the driver to reduce a moving speed of the door panels.

### Claim 11 (depends on 10)

The wafer transfer method according to claim 10, wherein the detector comprises:
a light source, connected to the controller and facing surfaces of the door panels, for projecting a detection light to the door panel under the control of the controller; and
two photoresistor receivers, connected to the controller, provided on sides of the door panels facing the second machine, and respectively provided on the two door panels, for detecting a light signal;
when the light projected by the light source is received by one or more photoresistor receivers, the detector sends a signal corresponding to the closing of the connection port to the controller.

### Claim 12 (depends on 11)

The wafer transfer method according to claim 11, the wafer processing apparatus further comprises:
a safety module, comprising a detection unit and connected to the controller and the manipulator, for detecting, by the detection unit, an open-closed state of the connection port, and controlling the manipulator to stop transferring the wafer to the first machine when the detection unit detects that the connection port is closed;
when the detection unit detects that the connection port is closed, the controller controls the light source to project the detection light to the door panels.

### Claim 13 (depends on 10)

The wafer transfer method according to claim 10, the detector further comprises: a metal sheet and an inductive switch sensor, the metal sheet and the inductive switch sensor are respectively provided on surfaces of the same side of the two door panels, when a distance between the metal sheet and the inductive switch sensor changes, an electrical parameter output by the inductive switch sensor changes accordingly; when the detector is controlled to detect the open-closed state of the connection port, the wafer transfer method further comprises:
reducing a driving speed of the driver when the electrical parameter output by the inductive switch sensor is within the preset range.